Interfacial reaction and shear strength of AuSn20/Ni solder joints

WEI Xiao-feng,WANG Ri-chu,PENG Chao-qun,FENG Yan

DOI: https://doi.org/10.19476/j.ysxb.1004.0609.2013.07.018

2013-01-01

Abstract:The AuSn20/Ni solder joints were prepared by the reflow process. The effects of the aging temperature and time on the microstructure and shear strength were investigated by the scanning electron microscope (SEM) with an energy dispersive X-ray (EDX). The results show that, a fine lamellar eutectic ζ′-Au5Sn+δ-AuSn microstructure and needle-like (Ni,Au)3Sn2 intermetallics are formed at the AuSn20/Ni joint after reflow at 300℃for 90 s. After aging at 150 ℃ for various times,the thickness of the IMC layer at AuSn20/Ni interface grows slightly with the aging time increasing from 150 h to 1 000 h, and the shear strength of the AuSn20/Ni joints declines accordingly. When aging at 200℃, the reaction rate of the AuSn20/Ni interface is faster than that when aging at 150℃. The thickness of the IMC layer grows rapidly with increasing the aging time while the shear strength of the joints declines almost lightly. Considering the mechanical reliability of the joints, the AuSn20/Ni joints cannot service at 200℃or higher temperature for a long time.