Abstract:Cracks at the soldering area during electromigration (EM) and isothermal ageing in solder joints has become a critical reliability issue with the development of electronic industry. Addressing to the fracture along the interface between Cu and Cu 3 Sn, This paper studied its interface strength under mode-I and mode-II loading condition with the strain rate of 0.0027 ps -1 via molecular dynamics (MD) simulation. MEAM (modified embedded atom method) was used for modeling the interaction between Cu-Sn atoms, and simulation box size of 55 Å × 47.7 Å × 69.12 Å was used for investigation the properties of the model interface. Especially, this paper focus on the effect of orientation of Cu on the interface strength of Cu 3 Sn-Cu interface structure. CSP (centro-symmetry parameter) was also analyzed for the better understanding of its dissipative mechanism. From the MD result, orientation of Cu has great influence on the Cu 3 Sn-Cu interface strength under mode-I deforming, and Cu 3 Sn-(001)Cu interface structure has a higher interface strength compared with others, while it have little effect under mode-II deforming condition.

Influence of Multi-Field Coupling on Interface Structures of Au/Cu/Si in Vacuum

The formation of heterointerface defects in Au/Cu films on Si substrates under direct current in a vacuum ultraviolet environment.

Electron Migration Behavior of Au/Cu Multilayer Films on Si Substrates under UV Radiation

Study on interface behavior of Be/CuCrZr alloy by diffusion bonding

The effects of interfaces stability on mechanical properties, thermal conductivity and helium irradiation of V/Cu nano-multilayer composite

Understanding the Impact of Surface Engineering, Structure, and Design on Electromigration Through Monte Carlo Simulation and In‐Situ SEM Studies

The Effect of Pressure and Orientation on Cu-Cu3Sn Interface Reliability under Isothermal Ageing and Monotonic Traction Via Molecular Dynamics Investigation

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation

The Effect of Cu Orientation on Fracture Location in Cu<inf>3</inf>Sn-Cu Interface Structure Under Monotonic Loading Condition by Molecular Dynamics Simulation

The effect of finish layer on the interfacial cracking failure of Au Si bonding

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

On the Microcrystal Structure of Sputtered Cu Films Deposited on Si(100) Surfaces: Experiment and Integrated Multiscale Simulation

The Stability and Electronic Structure of Cu(200)/AuCu(200) Interface: An Insight from First-Principle Calculation

OKMC Simulation of Vacancy-Enhanced Cu Solute Segregation Affected by Temperature/irradiation in the Fe–Cu System

Effect of the Diffusion Annealing on Concentration Distributions in interfacial Regions of Au/Ag-Cu/Cu-Ni-Zn Laminate Strips

Copper Metallization of Low-Dielectric-constant A-Sicof Films for ULSI Interconnects

Sintering mechanism between silver nanoparticles and SiC/Cu plates: A molecular dynamics simulation

Effects of Electric Field Annealing on the Interface Diffusion of Cu/Ta/Si Stacks

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Effect of interface oxidation treatment on the interfacial reactions and wear properties of co-continuous SiC3D/Cu composites

Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copper Pads