Abstract:Using molecular dynamics simulations, we study the roles of geometry, boundary conditions, and nanotwinned structure on the mechanical response of Cu cylindrical nanopillars under tensile loading. Specifically, we investigate the stress–strain responses, deformation mechanisms, and defect evolution in nanopillars of varying height-to-diameter ( ) ratios, capped with rigid layers to resemble hard coatings, and with microstructures consisting of columnar grains with and without nanoscale coherent twin boundaries (CTBs). Our results indicate that the disk-shaped nanopillars (DPs) with low ratios exhibit high yield strength, significant triaxial tension stress, and pronounced plastic deformation. This deformation is accompanied by high defect density near the Cu/rigid layer interfaces, driven by dislocation pile up from multiple activated slip systems. Conversely, the deformed rod-shaped nanopillars of large ratios exhibit localized plastic deformation characterized by necking phenomena. Our results reveal the dominant role of Shockley type dislocations in plastic deformation, particularly in DPs, which display higher dislocation densities due to reduced dislocation annihilation events at free surfaces and pile up at interfaces. Notably, deformed DPs exhibit a unique vacancy-induced nanovoid nucleation mechanism at interfaces, resulting from the coalescence of vacancies generated during shearing of jogs. Additionally, the results demonstrate that dislocations glide between CTBs forming wide stacking faults, or traverse CTBs in a zigzag pattern as perfect dislocations, confirming a recently hypothesized cross-slip-like transmission in a recent experimental observation. Our simulations indicate that nanometer-spaced CTBs in Cu nanopillars act as weak barriers to dislocation motion during tensile loading, leading to only a marginal enhancement of mechanical properties.

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