Abstract:The escalating demands of high-frequency applications demands the development of dielectric materials with low relative permittivity (dielectric constant) for efficient signal propagation. In light of the prevailing challenges and barriers, this article delves into the intricate mechanisms underlying the dielectric constants of low-k polymer composites while highlighting the challenges associated with their utilization. This study discusses the importance of consistent performance across various frequencies, processing conditions, and filler-matrix compatibility in dielectric properties. It also discusses the impact of thermal conductivity on dielectric behavior, the challenges of controlling porosity, moisture reduction implications, and the significance of haze in low-k and loss dielectric materials for high-frequency applications. The review also explores the impact of scattering and light transmission on material performance. Finally, this study outlines the utilization of various low-k polymer composites, including Polytetrafluoroethylene (PTFE), Polyimide (PI), Polyphenylene oxide (PPO), Polyethylene (PE), Polypropylene (PP), Polyvinylidene difluoride (PVDF), Cyclic Olefin Copolymer (COC), Perfluoroalkoxy's (PFA), & Poly(benzoxazoles) (PBO) to highlight their potential applications in high-frequency scenarios. By comprehensively investigating the dielectric constant and related challenges in low-k polymer composites, this study article aims to contribute to understanding and advancing materials for high-frequency applications. The insights provided herein offer valuable guidance for researchers, engineers, and manufacturers in the ongoing pursuit of efficient and reliable dielectric materials for the modern high-frequency electronic packaging industries.

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