Behaviors of immersion flow in micro-gap with moving boundary

Hui Chen,Heng Du
DOI: https://doi.org/10.4028/www.scientific.net/AMM.423-426.894
2013-01-01
Applied Mechanics and Materials
Abstract:In order to improve the flow stability when wafer scans at high speed, immersion lithography with small flow-thickness is proposed for the high resolution lithography. By using the numerical methods, the immersion flow is investigated to analyze the behaviors of liquid flow. Based on the flow characteristics of typical structures with different liquid thickness and scanning speed, the liquid mean-velocity on account of thousand sample points in the exposure area are studied, and the appropriate parameters and method of effective renovation with small thickness are also given.
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