Abstract:Immersion lithography seeks to extend the resolution of optical lithography by filling the gap between the final optical element and the wafer with a liquid characterized by a high index of refraction. The semiconductor industry demands high throughput, leading to relatively large wafer scanning velocities and accelerations. For higher scanning velocities, an issue that has been identified is the deposition of the immersion liquid while confining a relatively small amount of liquid to the under-lens region. Liquid loss occurs at the receding contact line that forms when a substrate is withdrawn from a liquid, which potentially leads to defects on printed patterns. There has been substantial prior work relative to understanding and building semi-empirical correlations and numerical models to investigate this behavior of the receding three-phase contact line. In the current work, a new liquid injection and collection model with analytic solutions is presented and compared with experimental results, in which the critical velocity for liquid loss is mainly a function of the vacuum degree, the injection flow rate, the properties of the immersion liquid. This correlation allows the critical velocity to be predicted with a given gap height between wafer and lens using only a measurement of the injection speed and knowledge of the fluid properties. Experimentally, glycerin-water mixtures of varying viscosities and different injection flow rates were tested, with variable outlet vacuum degree and inlet speed, showing a mean average error within 12%. This correlation represents a useful tool that can serve to approximately guide the development of fluid control for immersion systems as well as to evaluate alternative immersion fluid candidates to minimize liquid deposition while maximizing throughput.

Effect of upper surface characteristics on meniscus stability in immersion flow field

Simulation and Experimental Investigation of Immersion Flow Field in Immersion Lithography

Investigation on the critical velocity for liquid loss in immersion lithography

Lumped-Parameter Modeling For Meniscus Dynamic Analysis In Immersion Flow Field

Lumped-Parameter Modeling of an Immersion Flow Field for Analyzing Meniscus Dynamic Behavior

Flow Behavior Control in Immersion Lithography

Simulation Of The Velocity Distribution For Immersion Lithography

Modeling fluid velocity response for wafer scanning in immersion lithography

On the Dynamics of Head-on Collision of Sessile Droplets on the Traveling Substrate

Effect of Liquid Dispensing on Flow Field for Immersion Lithography

SIMULATING PRESSURE DISTRIBUTION ON LENS RELEVANT TO FLUID INJECTION FOR IMMERSION LITHOGRAPHY

Modelling Slip Flow in Micro/nano Gaps with Moving Boundary

Lens distortion for liquid renovation in immersion lithography

Impact on Fluid Flow State by Different Structural Parameters of Immersion Lithography Unit

Effects of dwell time of excitation waveform on meniscus movements for a tubular piezoelectric print-head: experiments and model

Meniscus Dynamics in Material Processing

Thermal And Dynamics Analysis Of Meniscus-Controlled Materials Processing

DESIGNING AND EXPERIMENTAL INVESTIGATION OF AN IMMERSION UNIT WITH DOUBLE GAS-CURTAIN SEALING FOR IMMERSION LITHOGRAPHY

Axisymmetric thermo-mechanical analysis of laser-driven non-contact transfer printing

Influence of fluid flow on the stability and wetting transition of submerged superhydrophobic surfaces.

A Numerical Investigation on Micro Particle Dynamics Near an Evaporating Meniscus