Novel Cyanate Ester Resin Composites for Microelectrical Packaging

XUE Jie,YE Ju-hua,GUAN Qing-bao,LIU Ping,LIANG Guo-zheng
DOI: https://doi.org/10.3969/j.issn.1001-4381.2013.04.012
2013-01-01
Journal of Materials Engineering
Abstract:Three composites based on CE resin,aluminum nitride(AlN),nano AlN(n-AlN) and silicon dioxide(SiO2),and silane coupling agent(KH560) modified AlN and SiO2,coded as AlN/CE,n-AlN/CE,AlN-SiO2/CE and AlN(KH560)-SiO2(KH560)/CE composite,respectively,were prepared.The influences of the sort,size and surface nature of fillers on the thermal conductivity and dielectric properties of composites were investigated in detail.The results show that properties of fillers have great influence on the thermal conductivity of composites.When CE resin was filled by n-AlN and AlN,the resultant composites increased thermal conductivity due to the close arrangement.The composite with a higher content of AlN had higher dielectric constant.But when SiO2 was used to replace AlN,the increasement of dielectric constant was reduced.
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