Abstract:This paper describes the design and performances of a novel focal-plane array (FPA) containing pixels of double bimaterial-layer cantilevers without silicon (Si) substrate for being applied in the uncooled optical-readable infrared (IR) imaging system. The top layer of the cantilever pixels is made of two materials with large mismatching thermal expansion coefficients: silicon nitride (SiNx) and gold (Au), which convert IR heat into mechanical deflection. The bottom layer is SiNx cantilever, which partially serves thermal isolation legs. The top and bottom pads form the resonant cavity, which can dramatically enhance the absorption of incident IR irradiation, and the substrate-free configuration enables reducing the loss of incident IR energy. Responding to the IR source with spectral range from 8 to 14 mum, the IR imaging system may receive an IR images through visible optical readout method. A thermal-mechanical model for such cantilever microstructure is proposed, and the thermal and thermal-mechanical coupling field characteristics of the cantilever microstructure are optimized through numerical analysis method and simulation by using the finite-element method. The thermal-mechanical deflection simulated is 7.2 mum/K, generally in good agreement with what the thermal-mechanical model and numerical analysis forecast. The analysis suggests that the detection resolution of current design is 0.03 K, whereas the noise analysis from FPA indicates the current resolution to be around 100 muK and the limit noise-equivalent temperature difference (NETD) of the IR imaging system can reach to 7 mK.

A Substrate-Free Optical Readout Focal Plane Array with a Heat Sink Structure

Thermal and Mechanical Characterizations of A Substrate-Free Focal Plane Array

A Holistic Approach Performance Analysis of Substrate-Free Focal Plane Array

Performance of an Optimized Substrate-Free Focal Plane Array for Optical Readout Uncooled Infrared Detector

Uncooled Infrared Imaging Using a Substrate-Free Focal-Plane Array

Imaging of the Mid-Infrared Focal Plane Array with a Modified Read-Out Circuit.

Structure Optimization and Performance Analysis of A Substrate-free Focal Plane Array

Design of a Novel Substrate-Free Double-Layer-Cantilever FPA Applied for Uncooled Optical-Readable Infrared Imaging System

Design And Fabrication Of A High Sensitivity Focal Plane Array For Uncooled Ir Imaging

A MEMS Based Focus Plane Array for Infrared Imaging

Equivalent Circuit Model of the Substrate-Free Focal Plane Array Based on the Optical Readout Uncooled Infrared Imaging System

A Novel MEMS-based Focal Plane Array for Infrared Imaging

Design, Fabrication, and Characterization of A Polymer-Based Mems Uncooled Infrared Focal Plane Array

Advance in Optically Readable Uncooled Infrared Imaging

Design, simulation and validation of a novel uncooled infrared focal plane array

Ir Imaging Using A Cantilever-Based Focal Plane Array Fabricated By Deep Reactive Ion Etching Technique

Bimaterial Cantilever Focal Plane Array for Uncooled Infrared Imaging Using Sandwich-Framed Structure

Performance analysis of the substrate-free focal plane array in infrared imaging

Development Of Infrared Fpa Using Bimaterial Microcantilever Arrays

Uncooled Focal Plane Array for Multiband IR Imaging Using Optical-Readout Bimaterial Cantilevers

Development of a High Performance 1280×1024 InGaAs SWIR FPA Detector at Room Temperature