Abstract:In recent years, nanomachining has received an increasing attention because of the remarkable advancement in sciences and technologies. In nanomachining process, the atomic interaction in surface and subsurface layers plays an important role. At such a small nanoscale, the traditional continuum representation method, such as finite element method, becomes questionable. This difficulty can be solved in general by molecular dynamics (MD). MD provides the necessary insight into nanomachining process and allows researching local material properties and behaviors in detail. Based on the large scale parallel algorithm, a new three-dimensional molecular dynamics simulation model was established for nanomachining of single crystal Cu. The interactions between workpiece atoms (Cu-Cu), copper and diamond atoms (Cu-C), and diamond atoms (C-C) were described by embedded atom method (EAM), Morse and Tersoff potentials, respectively. The temperature distribution and thermal effects during nanomachining were investigated. The chip formation and nanomachining mechanism were analyzed from the point of view of dislocation theory and thermal effects. The simulation results demonstrate that both the dislocation emission and chip pileup direction are along the h110i orientation. Temperature distribution presents a roughly concentric shape and a steep temperature gradient lies in diamond tool, and the highest temperature is found in chip. The workpiece material becomes soft as the system temperature increases. Cutting speed and cutting edge radius have a significant effect on the system temperature distribution.

Molecular Dynamics Simulation of Thermoelastic Coupling Characteristic for Low-Dimensional Nano-Rod under Thermal Shock

MD Simulation of a Copper Rod under Thermal Shock

A Molecular Dynamics Study on Mechanical Performance and Deformation Mechanisms in Nanotwinned NiCo-based Alloys with Nano-Precipitates under High Temperatures

Transient Responses of a Hollow Cylinder under Thermal and Chemical Shock Based on Generalized Diffusion-Thermoelasticity with Memory-Dependent Derivative

Molecular dynamics study of the mechanics of metal nanowires at finite temperature

Molecular Dynamics Simulation On Bending Behaviour Of Metal Nanorod

Size Effects on the Impact Response of Copper Nanobeams

Molecular Dynamics Simulation on Torsion Deformation of Copper Aluminum Core–shell Nanowires

Molecular Dynamics Simulation of Timescale Effect and Lattice Transformation of Copper Nanorod under Bending

Molecular Dynamics Simulations of Thermal Effects in Nanometric Cutting Process

Simulation of Scale Dependency on Tensile Mechanical Properties of Single Crystal Copper Nano-Rod

Nonlocal thermoelasticity and its application in thermoelastic problem with temperature-dependent thermal conductivity

Non-equilibrium Molecular Dynamics Study of Nanoscale Thermal Contact Resistance

MOLECULAR DYNAMICS SIMULATIONS OF NANOMA-CHINING MECHANISM AND THERMAL EFFECTS OF SINGLE CRYSTAL Cu

Molecular Dynamics Simulations of Thermal Evaporation and Critical Electric Field of Copper Nanotips

Atomistic simulation of tension properties of nano crystal copper wire under surface effects

Molecular dynamics simulation of loading rate and surface effects on the elastic bending behavior of metal nanorod

Molecular dynamics simulations of nanomachining mechanism and thermal effects of single crystal Cu

Molecular Insight into the Deformation of Single Crystal Copper Loaded by High-Speed Shock Wave

Molecular Dynamics Study of Thermal Stress and Heat Propagation in Tungsten under Thermal Shock

Thermal stress effects on size-dependent nonlinear axial vibrations of nanorods exposed to magnetic fields surrounded by nonlinear elastic medium