Dynamic mechanical behavior of microelectronic components determined by impact shear

Ye Zhang,Yangjian Xu,Yong Liu
2012-01-01
Abstract:Fracture failure of interface is a main failure mode in the electronic products. In dynamic mechanical behavior of microelectronic components determined by impact shear tests and FEM simulations, the fracture behaviour is investigated for its mechanical response under an impact action. The dynamic mechanical behaviour of solder ball is determined by a combination with fast shear tests and FEM (finite element method) simulations, an indication that the solder ball is going through from ductile failure to brittle failure is found from experiment, then a 3D dynamic simulation based on LS-DYNA is conducted. In order to simulate the fracture of interface (intermetallic compounds lays) subjected to an impact load, a cohesive zone model is used in combination with the general elastic-plastic constitutive model. The simulation result shows that the proposed impact dynamic model can be applied in the dynamic analysis.
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