Modeling and Analysis of Crosstalk Induced Effects in Graphene-Carbon Nanotube Composite Interconnects
Fa Zou,Zhongliang Pan
DOI: https://doi.org/10.1016/j.micrna.2024.207946
2024-01-01
Micro and Nanostructures
Abstract:This paper proposes an equivalent circuit model for two-line coupled multilayer graphene nanoribbon - single-wall carbon nanotube (MLGNR-SWCNT) composite interconnects (MSCs), incorporating the effects of coupling capacitance and mutual inductance. We also examine the temperaturedependent crosstalk effect on the victim line of MSCs in the time domain using decoupling techniques and the ABCD parameter matrix approach. This analysis is conducted at the global level of 7 nm, 14 nm, and 22 nm technology nodes, comparing the performance of MSCs with MLGNR, SWCNT, and copper (Cu) interconnects, validated through HSPICE simulations. Our results reveal that the crosstalk delay of all interconnects induced by dynamic crosstalk exhibits superior performance in the in-phase crosstalk mode compared to the out-of-phase mode at room temperature. In particular, MSCs demonstrate less crosstalk delay in both crosstalk modes compared to SWCNT and Cu interconnects. In addition, we analyze the crosstalk delay of the victim line for two-line coupled MSCs at varying temperatures in out-of-phase crosstalk mode, comparing them with MLGNR, SWCNT, and Cu interconnects. Simulation results indicate that the crosstalk delay is temperature-dependent, increasing with rising temperatures, and the crosstalk delay of MSCs is the least of all interconnects. Furthermore, we investigate the crosstalk noise of MSCs induced by functional crosstalk at different temperatures, comparing it with MLGNR, SWCNT, and Cu interconnects. It is observed that the crosstalk noise peak remains constant with temperature changes across all interconnects; however, the holding time and width of crosstalk noise increases with rising temperatures and MSCs have the least crosstalk noise peak and crosstalk noise width of all interconnects. Also, numerical results exhibit that reducing interconnect temperature, SWCNT diameter, and edge roughness of MLGNR are effective strategies to diminish the crosstalk delay of MSCs. In addition, increasing line spacing is identified as an effective method to reduce crosstalk noise peak of MSCs of different lengths. The proposed model results show excellent agreement with HSPICE simulation data. Therefore, our analysis of crosstalk effect manifests that MLGNR-SWCNT composite can be a promising material to replace SWCNT and copper as an ideal material for global interconnect applications in thermally variable environments.