Three-Dimensional Numerical Simulation for Annular Condensation in Rectangular Microchannels

Jiafeng Wu,Yongping Chen,Mingheng Shi,Panpan Fu,G. P. Peterson

DOI: https://doi.org/10.1080/15567260802625882

IF: 4.629

2009-01-01

Nanoscale and Microscale Thermophysical Engineering

Abstract:A three-dimensional model in rectangular microchannels with constant heat flux is developed to predict steady annular condensation. The condensate flow field on the side wall, which is dominated by surface tension, is divided into two regions: the thin–film region and the meniscus region. The momentum and mass equations, in both the vapor and meniscus regions, along with the film thickness equation in thin–film region are solved numerically. The distribution of the meniscus curvature radius, thickness of the condensate film, heat transfer coefficient, and wall temperature are all determined. The results indicate that with the development of condensation, the condensate in the thin–film assumes a convex profile shape at the side wall, with the crest located at the midpoint of the side wall. The film thickness in the thin-film region increases at upstream locations and decreases as the flow moves downstream. The average heat transfer coefficient in the thin-film region is much larger than that occurring in the meniscus region. And the highest local heat transfer coefficient occurs at the intersection of the thin-film region and the meniscus on a cross section where the maximum wall temperature exists. The circumferential average heat transfer coefficient decreases drastically upstream to a lower value. After that, it remains nearly constant until close to the end of the annular flow, where it again begins to decrease.