Study on Cu-Sn Alloy Electrodeposition
Haruo INAGAKI
DOI: https://doi.org/10.4139/sfj1950.9.338
1958-01-01
Journal of the Metal Finishing Society of Japan
Abstract:Experiments on electroplating of Cu-Sn alloys under various conditions were carried out in the plating solution composing mainly of copper cyanide and sodium stanate, of which five kinds were used varying the ratio of Cu/Sn from 7/10 to 16/1.The results of X-ray diffraction examination are as follows:1. Sn content in the electrodeposited Cu-Sn alloys varies from 10 to 78%. Phases in the alloys are classified into four groups, namely, (a) α only, (b) α+η, (c) η only, and (d) θ+ξ.2. In the electrodeposited alloys, the phase of (η+ζ), which exists in the equilibrium phase diagram of Cu-Sn alloy, can not be seen, and the region of this phase is displaced by η and (θ+ξ) phases.3. β, δ, and ε phases, which exist in the phase diagram at high temperature, also can not be seen in the deposited alloy.4. In the electroplated alloy of speculum plating, only (α+η) or η phase is crystallized and the number of diffraction patterns in this case is significantly small as compared with that in the other cases.5. The composition of the deposited alloy is decided mostly depending upon the composition of plating solution, but not mach upon other plating conditions such as current density, stirring, etc.