Abstract:High crash strength and high thermal conductivity hollow ceramic sphere with external diameters between 250 and 420 micrometers were produced by firing green bodies prepared in a fluidized reactor at room temperature. Then these spheres were bonded together by epoxy resin to produce composites with very high filler concentration but light weight. The dielectric, thermal and mechanical properties of the composites were investigated. Because the component in the raw materials of hollow ceramic spheres is varied, the corresponding composites have tunable permittivity and dielectric loss. In the composites, hollow ceramic spheres are nearly close packed, which can be observed by optical microscope. The novel close packed structure of these spheres endows the composites with highly efficient pathways for heat dissipation and reliable framework of bearing compressive loading. The surfaces of the spheres were modified by 1wt. % silane coupling agent, KH-560, before combining with epoxy resin in order to improve their chemical compatibility with epoxy resin. With TGA results, we can see that the epoxy resin in the composites has a low percentage of mass ratios and thus plays a role as binder to combine neighboring hollow ceramic spheres together. The results demonstrate improvement of dielectric and thermal conducting properties of epoxy resin, and feasibility of extending its working ranges in both compression strength and temperature as a multifunctional material in insulating area.

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