Microstructural Modeling and Simulation of Al-2.8Cu-1.4Li Alloy During Elevated Temperature Deformation

L. Deng,X. Y. Wang,J. C. Xia,H. T. Guo
DOI: https://doi.org/10.1007/s11661-011-0657-4
2011-01-01
Metallurgical and Materials Transactions A
Abstract:The objective of the present work was to investigate the dynamic recrystallization phenomenon of a new Al-2.8Cu-1.4Li alloy. Isothermal compression experiments were carried out at a temperature of 643 K to 723 K (370 °C to 450 °C), strain rate of 0.001 to 1 s−1, and deformation degree of 20 to 50 pct to determine material parameters for empirical models. Different holding times from 10 to 30 minutes were set to obtain the effect of initial grain size on microstructural evolution. Based on the results of stress-strain curves and metallographic analysis, the constitutive model and dynamic recrystallization mathematical model of Al-2.8Cu-1.4Li alloy were derived. The coupled thermomechanical finite element method integrated with the dynamic recrystallization model was used to simulate the change of microstructure during hot upsetting. Good agreement between the predicted results and experimental results was obtained, which demonstrated that the dynamic recrystallization model can be successfully used to predict microstructural evolution during hot working for Al-2.8Cu-1.4Li alloy.
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