Abstract:The majority of studies on high-reliability solder alloys have focused on the six-element system of Sn, Ag, Cu, Bi, Sb, and Ni. However, there is limited research on the influence of Co element within this system. In this study, a Sn3.0Ag0.5CuBiSbNixCo (x = 0 wt%, 0.02 wt%, 0.05 wt%, 0.08 wt%, 0.1 wt%) alloy (referred to as SACBSN-xCo alloy) was prepared using a melting method. The mechanical properties of SACBSN-xCo alloy solder joints were evaluated through ultimate shear strength testing. The composition analysis of the alloy, phase composition examination, intermetallic compound (IMC) investigation and interfacial layer morphology analysis were conducted using ICP, XRD, SEM and EDS techniques respectively. Furthermore, the evolution process of solder structure and solder joint interface layer under different aging times was observed in detail. Results indicate that with the addition of Co element in the alloy solder system two heat release peaks appear during the solidification process; specifically when adding 0.05 wt% Co element content to the mixture it reduces supercooling degree by 15.17 °C to only 1.03 °C; Moreover wettability improvement can be achieved to some extent when adding either 0.02 wt% or 0.05 wt% Co content. The addition of trace Co can inhibit the excessive growth of IMC in the solder alloy matrix and refine the alloy structure. It can promote the growth of Cu 6 Sn 5 -based IMCs and inhibit the growth of Cu 3 Sn layer in intermetallic compound layer (IMCs). In addition, the mechanical properties and thermal fatigue stability of the solder joints are steadily improved by Co element. After adding Co element, the shear strength of the alloy solder joint is increased by about 14.84 %. After aging at 150 °C for 25 days, the shear strength of SACBSN-xCo alloy solder joints is increased by about 20.4 %, which significantly improves the thermal fatigue stability of the solder joints after high temperature aging treatment. The results show that when Co content is 0.05 wt%, the alloy solder has better comprehensive properties.

Thermodynamic assessment of the Sn–Ag–Co system and solidification simulation of the ternary alloy

Effect of Co Addition on Solidification Velocity, Hardness and Refined Structure Transformation Mechanisms of Undercooled Ni-Cu-Co Alloys

Thermodynamics and solidification kinetics of Ag–Ni–Co immiscible alloys

Directional Solidification and Liquidus Projection of the Sn-Co-Cu System

Co alloying and size effects on solidification and interfacial reactions in the Sn−Zn−(Co)/Cu couples

Liquidus Projections of Sn-Co-Ni and Sn-Rich Sn-Ag-Co-Ni Systems

Phase Equilibria and Solidification of Ternary Sn–Bi–Ag Alloys

Liquidus Projection and Thermodynamic Modeling of a Sn-Ag-Zn System

Effect of Minor Addition of Co on Nonequilibrium Solidification of Deeply Undercooled Cu Based Alloys

Thermodynamic Properties and Phase Equilibria of Sn–Bi–Zn Ternary Alloys

Effect of Co on microstructure evolution and thermal fatigue stability of lead-free solder alloys of SACBSN series

Thermodynamic properties and primary phase structures of ternary Cu90−xSnxSb10 alloys investigated by differential scanning calorimetry and laser flash method

Microstructural, thermal and mechanical properties of Co added Sn–0.7Cu lead-free solder alloy

Effects of Co Alloying and Size on Solidification and Interfacial Reactions in Sn-57 Wt.%bi-(Co)/cu Couples

Solidification Process and Microstructure Evolution of Bulk Undercooled Co–Sn Alloys

Phase Equilibria of Sn-Co-Cu Ternary System

Thermodynamic description and simulation of solidification microstructures in the Cu–Mg–Zn system

Effects of Intermetallic-Forming Element Additions on Microstructure and Corrosion Behavior of Sn–Zn Solder Alloys

Co effect on rapid solidification microstructure transition of highly undercooled copper alloys

Effects of Co Addition on the Microstructure and Properties of Elastic Cu-Ni-Si-Based Alloys for Electrical Connectors

Effect of Co on Solidification Characteristics and Microstructural Transformation of Nonequilibrium Solidified Cu-Ni Alloys