INVESTIGATION OF FINITE ELEMENT MODELING METHOD UNDER THERMAL LOAD

WANG Jun,PAN Bin,XU Wei
DOI: https://doi.org/10.3969/j.issn.1001-4500.2006.04.003
2006-01-01
Abstract:The thermal load can make the distribution of the transient temperature field of the grillage non-uniform,and create the distribution of the thermal stress field.The THERMAL and STRUCTURAL modules of MSC software are used for investigating the panel of the deck in the modeling process,and the influence of the modeling method and the mesh density of the stiffener to the distribution of the temperature field,the stress field and the displacement are discussed in this paper.After analyzing and investigating,we give feasible suggestions to modeling finite element module under the thermal load.
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