Influences of Geometrical Characteristic of Inorganic Fillers Particles on Thermal Conductivity of EP Encapsulating Adhesive

何兵兵,傅仁利,江利,石志想,俞晓东

DOI: https://doi.org/10.3969/j.issn.1004-2849.2010.07.005

2010-01-01

Abstract:With five kinds of inorganic fillers(such as Al2O3,Si3N4,BN,SiO2 and AlN) as thermal conductive fillers of epoxy resin(EP) encapsulating adhesive,so influences of some factors(such as the types,size and shapes for the fillers particles) were investigated on the thermal conductivity of EP encapsulating adhesive.The results showed that the thermal conductivity of EP encapsulating adhesive was increased with increasing thermal conductive fillers contents.The relative maximal thermal conductivity of EP encapsulating adhesive,which was about ten times more than of EP matrix,was 2.12 W/(m·K) when the volume fraction of BN was 35% in total volumes.The geometrical characteristic of fillers particles had great influence on the thermal conductivity of EP encapsulating adhesive,and its relative maximal thermal conductivity was 1.3 W/(m·K) when size of Al2O3 particles was 48 m,but its thermal conductivity was reduced when size of fillers particles was oversize or undersize.The lamellar fillers particles could availably enhance thermal conductivity of EP encapsulating adhesive because lamellar fillers particles had biggish bulk density,and could fashion better thermal conductive channels in EP encapsulating adhesive.