Novel Curing Agent for Lead‐free Electronics: Amino Acid

Y Li,F Xiao,KS Moon,CP Wong
DOI: https://doi.org/10.1002/pola.21239
2005-01-01
Journal of Polymer Science Part A Polymer Chemistry
Abstract:A basic type of amino acid, lysine, was used as a novel ecofriendly curing agent of epoxy in electronic materials. Differential scanning calorimetry and in situ Fourier transform infrared spectroscopy characterizations suggested a different reactivity and reaction mechanism for amino acid cured epoxy than for a typical amine or carboxylic acid cured epoxy. The primary amine in the lysine participated in the curing reaction first and was followed by the protonation of the secondary amine NH on another epoxy group and the esterification of the carboxylic group in lysine with epoxide. The crosslinked epoxy with amino acid was thermally degradable and could be used as a reworkable resin as well.
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