Research into High Speed PCB Power Integration

BAI Tong-yun

DOI: https://doi.org/10.3969/j.issn.1673-5692.2006.01.007

2006-01-01

Abstract:A successful high-speed printed circuit board(PCB) requires signal integrity and power integrity,must reduce the effects of ground bounce.To filter ground bounce noise,recommends placing the decoupling capacitors to Vcc and ground pair.

What problem does this paper attempt to address?

Power integrity analysis for high-speed PCB

Wang Li-Xin,Zhang Yu-Xia,Zhang Gang

DOI: https://doi.org/10.1109/PCSPA.2010.106

2010-01-01

Abstract:In high-speed digital circuit, supplying a clear power to the integrated circuit and managing the coupling of power noise which can cause fluctuations or disturbances in the power distribution system have become the bottleneck of high-speed digital circuit designs. So it is expected to be a challenging problem for the power integrity (PI) design due to the wider bandwidth of the noise. Keeping the power distribution network (PDN) impedance very low in a wide frequency range and reduce simultaneous switching noise (SSN) are priority ways for the power integrity (PI) design. The decoupling capacitors are conventionally used to minimize the power impedance at a frequency where the impedance of the decoupling capacitor is lower than that of the power/ground planes pair. This paper investigates both in time and frequency domains the power integrity with the help of full-wave finite-element simulations. The solution which is based on the decoupling capacitors is reviewed in this paper. Besides, the placement and value of the decoupling capacitors will be discussed. © 2010 IEEE.
PCB Layout Optimization of High-Frequency Inverter for Magnetic Coupled Resonance Wireless Power Transfer System

Dongsheng Yang,Zixin Cheng,Hua Li,Sokhui Won,Bowen Zhou,Jiangwei Tian

DOI: https://doi.org/10.1109/access.2019.2944972

IF: 3.9

2019-01-01

IEEE Access

Abstract:Magnetic coupled resonance wireless power transfer system has the advantages of long transfer distance and high efficiency. However, it needs a high-frequency AC power, and the influence of the circuit parasitic elements at high frequency cannot be ignored, which brings challenges to the research and the design of the high-frequency power for the wireless power transfer system. In this paper, the effect of the parasitic elements in the full-bridge inverter and the reasons of high-frequency ringing generated are analyzed in detail. The influences of device packaging and the printed circuit board (PCB) layout on circuit parasitic elements are studied. An optimized inverter PCB layout design that aims to reduce the parasitic elements and to provide a stable and high-quality AC power for the wireless power transfer system is presented. Finally, the performance of the conventional PCB layout design and the proposed optimized PCB layout design are compared through experiments. The experiment results show that the proposed design not only reduces the parasitic inductance in the circuit, but also reduces the electromagnetic interference noises and improves the stability of the inverter at 900kHz switching frequency.
In-package P/G Planes Analysis and Optimization Based on Transmission Matrix Method

Yin-jun Wang,Cheng Zhuo,Jun-yong Deng,Jin-fang Zhou,Kang-sheng Chen

DOI: https://doi.org/10.1631/jzus.a071489

2008-01-01

Abstract:Power integrity (PI) has become a limiting factor for the chip’s overall performance, and how to place in-package decoupling capacitors to improve a chip’s PI performance has become a hot issue. In this paper, we propose an improved transmission matrix method (TMM) for fast decoupling capacitance allocation. An irregular grid partition mechanism is proposed, which helps speed up the impedance computation and complies better with the irregular power/ground (P/G) plane or planes with many vias and decoupling capacitors. Furthermore, we also ameliorate the computation procedure of the impedance matrix whenever decoupling capacitors are inserted or removed at specific ports. With the fast computation of impedance change, in-package decoupling capacitor allocation is done with an efficient change based method in the frequency domain. Experimental results show that our approach can gain about 5× speedup compared with a general TMM, and is efficient in restraining the noise on the P/G plane.
Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Boping Wu,Haogang Wang

DOI: https://doi.org/10.1109/EDAPS.2011.6213775

2011-01-01

Abstract:Design of high performance package interconnects using full-wave electromagnetic solvers is necessary due to increased operation speed, miniaturization and vertical 3D integration. Thus the segmented study and optimization is becoming inevitable for designers to improve the signal integrity of IC packaging. This paper addresses alternative methods and optimal designs on several components and structures for package electrical interconnect, including voiding technique, padless via implementation, spiral micro-via stacking and signal/ground layout patterns. The simulated time domain results have been presented to demonstrate the improvements of optimized schemes. These methodologies could be treated as handy references and general guidelines applied to differential package line resulting in a significant improvement of overall package signal integrity performance.
Study on the power bus noise isolation using a SPICE compatible method

Zhi Hong Liu,Er Ping Li,Kye Yak See,En Xiao Liu

DOI: https://doi.org/10.1109/ISEMC.2005.1513554

2005-01-01

Abstract:In nowadays high speed PCB design, the normal operation of the analog integrated circuits depends much on the stable voltage supply between DC power and ground. To maintain the signal fidelity and mitigate the effect of SSN (simultaneous switching noise) on the power signal, power bus plane segmentation and noisy device isolation using power island are often employed. This paper proposed one method that can simulate the effects of the power bus noise isolation using the SPICE compatible method to provide the strategy to the IC design.
Analysis of Rectangular Power-Ground Plane Pairs for Noise Suppression

enxiao liu,zaw zaw oo,erping li

DOI: https://doi.org/10.1109/ESTC.2006.280004

2006-01-01

Abstract:Design of low-impedance power distribution network is vital to ensure power integrity as well as signal integrity for high-speed packages and printed circuit boards (PCBs). In this paper, we conducted a case study for a typical rectangular power-ground structure. Both analytical and numerical methodologies are used for this purpose. We studied how the impedance of a power-ground structure is affected by the location of the noise injection point, lossy substrate, edge radiation, decoupling capacitors and vias. Conclusions are drawn for this study.
Improved Eigenmode Expansion Method for Investigating of Ground Bounce in Power/ground Plane with Holes in PCBs

Ming-Yue Qiao,Wen-Yan Yin,Jun-Fa Mao

DOI: https://doi.org/10.1109/apemc.2008.4559941

2008-01-01

Abstract:An improved eigenmode expansion method (EEM) is proposed for analyzing power/ground plane pairs in high-speed printed circuit boards (PCB). We notice that the EEM is only applicable for regular structures in a PCB, such as rectangular and circular geometries, and it costs much computational time. Therefore, asymptotic waveform evaluation (AWE) technique and inverted composition method are combined with the EEM for capturing frequency-dependent transfer and self impedances of the power/ground plane with single or even many holes. The simulation results show that good agreements are achieved between our results and those obtained by finite-element method (FEM).
Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location

MI Montrose,HF Jin,EP Li

DOI: https://doi.org/10.1109/isemc.2004.1349995

2004-01-01

Abstract:With increasing demand for higher operating frequencies, designers are faced with numerous obstacles during the design and layout of printed circuit boards (PCBs). One area of concern that a designer may not think about, or recognize during the analysis stage, is the effects of RF wave propagation between the power and return planes caused by digital circuits switching logic states while consuming a large amount of inrush surge current. This is becoming an important design issue that should be considered prior to final PCB layout. The placement of components on a PCB and their physical distance to the edge of the assembly is the area of concern addressed, along with RF emissions that may propagate from the edge of the PCB causing potentially harmful effects under specific operating conditions and configurations.
A Novel Electromagnetic Bandgap Design Applied for Suppression of Printed Circuit Board Electromagnetic Radiation

Panpan Zuo,Yan Li,Er-Ping Li,Tao Song,Mengjun Wang,Hongxing Zheng

DOI: https://doi.org/10.1002/mmce.21990

IF: 1.987

2019-01-01

International Journal of RF and Microwave Computer-Aided Engineering

Abstract:In this article, a novel electromagnetic bandgap structure is applied to a high-speed printed circuit board, where the proposed concept is to etch with traditional L-bridge and extended connecting branches on the power plane. To investigate the electromagnetic characteristics of the proposed structure, its transmission performance is determined including an equivalent circuit to numerically predict the lower cutoff frequency. A near field electromagnetic interference measurement is carried out compared to a reference board to investigate the simultaneous switching noise suppression ability.
Progress in Research on High-frequency Printed Circuit Boards

YANG Yan,LI Sheng-tao

DOI: https://doi.org/10.3969/j.issn.1009-9239.2007.06.010

2007-01-01

Abstract:The requirements for high-frequency PCB (printed circuit board) and the limitation of the traditional PCB were summarized. The modified methods based on the resin, reinforced fibre and configuration were presented and estimated. Other methods to optimize the property of PCB based on the design and embed passive components were mentioned too. The measuring methods under high-frequency condition and the calculating model of dielectric constant were given. Finally, some problem to be solved in high-frequency PCB and the prospect of the research were pointed out.
PI-EMI co-analysis of ground via effect

lingsong zhang,xuequan yu,lin yang,xiaojuan wang,xingchang wei

DOI: https://doi.org/10.1109/APEMC.2013.7360646

2013-01-01

Abstract:To get a good power integrity (PI) and low electromagnetic interference (EMI) in high-speed circuits, the ground via and/or decoupling capacitor is always applied by the engineers. An appropriate placement of the ground via can reduce the input impedance which is resulted from the resonance between two ground planes, and eliminate the noise source caused by the discontinuity of the signal via, where such noise can act as the feed of the patch-antenna-Iike ground plane pair. In this paper, we analyze the placement of the ground via when the noise source is located at different positions of the board, furthermore, we propose a PI-EMI co-analysis method based on equivalent source model to derive the relationship between the input impedance of the ground planes pair and its far field radiation.
Board power bus decoupling using embedded capacitance

T. Hubing,M. Xu,J. Chen,J. Drewniak,T. V. Doren,R. DuBroff

2007-01-01

Abstract:The purpose of decoupling capacitors on printed circuit boards is to meet the instantaneous current demands of high-speed active devices while minimizing power bus noise. Embedded capacitance is an alternative to discrete decoupling capacitors and is achieved by taking advantage of the natural capacitance between the power and ground planes. This paper investigates the electrical properties of boards manufactured with four different kinds of embedded capacitance. These boards have powerground plane pairs separated by very thin materials with high dielectric constants. It is shown that some kinds of embedded capacitance work significantly better than standard decoupling schemes using discrete decoupling capacitors.
Time Domain PDN Noise Modeling for High Performance System

Han-Biao Jin,Er-Ping Li,Albert E. Ruehli,James L. Drewniak,Bruce Archambeault

DOI: https://doi.org/10.1109/epeps.2016.7835418

2016-01-01

Abstract:In this paper, we investigate the impact of the PDN inductance/impedance as well as the decoupling capacitors location on the initial IC noise voltage drop for a high performance system. To consider a worst case situation for the noise voltage at the integrated circuit (IC) we set the on-chip capacitance to zero. The impact of the delay due to remote location of the decoupling capacitors for fast rise-time current waveforms is also studied.
An Efficient Approach for the Power/ground Plane Equivalent Circuit Extraction

Zhi Hong Liu,Kye Yak See,Er Ping Li,Eng Kee Chua

DOI: https://doi.org/10.1109/emczur.2006.214950

2006-01-01

Abstract:Power/ground plane structure is widely used for power distribution purposes in multi-layer printed circuit board (PCB) design. The characteristic of board cavity may cause signal resonance at some frequencies and can lead to signal integrity (SI) and electromagnetic interference (EMI) concerns. An efficient method to extract the equivalent circuit of the power bus is proposed in this paper. With extracted equivalent circuit, time domain response of the power bus can be easily analyzed at the early design stage so that necessary measures to eliminate or minimize potential EMI problems can be implemented
Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

EP Li,WL Yuan,S Wang

DOI: https://doi.org/10.1002/mop.10624

IF: 1.311

2002-01-01

Microwave and Optical Technology Letters

Abstract:With advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community and application of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering has become an emerging technology. Termination, via, and crosstalk on interconnection lines raises EMI problems in high-speed circuits and requires attention during design phases for signal integrity. This paper analyzes signal propagation effects among different parts of high-speed interconnection lines using the finite-difference time-domain (FDTD) method. The mechanism and the effectiveness of control measures are examined, which can be applied to high-speed circuit designs. (C) 2002 Wiley Periodicals, Inc.
Achieving Minimal PDN Impedance, SSN and Jitter on PCB with Embedded Capacitance Material

Chang Fei Yee

DOI: https://doi.org/10.1109/RFM.2018.8846556

2018-12-01

Abstract:In this paper, the imperativeness of low power distribution network (PDN) impedance on printed circuit board (PCB) with high frequency signals operating at hundreds of Mega-Hz range and the impact of embedded capacitance material (ECM) in minimizing wideband PDN impedance are discussed. The study to compare the performance of PCB with ECM versus conventional dielectric FR4 material was conducted with post-layout power integrity simulation using Keysight ADS on the power net of interest, followed by measurement of PDN impedance and simultaneous switching noise (SSN) using network analyzer (VNA) and oscilloscope respectively on prototype PCB. Lastly, eye diagram and jitter of the high frequency clock signal on the PCB are observed. The correlated simulation and measurement results are presented and discussed in the later section of this paper.

Physics,Engineering,Materials Science
Influence of Decoupling Approach of Power Network on EMC Performance of Digital PCB

Feng Limin,Qian Zhaoming

DOI: https://doi.org/10.3321/j.issn:1000-6753.2007.04.003

2007-01-01

Abstract:Based on the equivalent circuits of the power network of digital printed circuit board (PCB) and the model of CMOS gates, it is presented in this paper that the impedance variation during the transient switching of digital gates is the cause ΔI noise in the power supply system. Thus, from the view of impedance matching and signal integrity, the decoupling method using the damped LC decoupling network is presented. It is verified by the simulation results that the damped LC decoupling network can both reduce the ΔI noise and transfer the noise from the power network to the local area of the digital IC without destroying the integrity of output signal. Based on the simulation results, some design rules are derived. The effect of the damped LC decoupling network on reducing the RFI noises is verified by the experiment results.
Power Integrity Analysis of TSV Based 3-D Integrated Circuits

Xing Chang Wei,Zaw,En-xiao Liu,Er-Ping Li

DOI: https://doi.org/10.1109/icmmt.2012.6229902

2012-01-01

Abstract:The power supply grids of integrated circuits (ICs) are interconnected through silicon vias (TSVs) to form a 3-D chip integration in vertical direction. The required currents for each functional device to operate in the ICs are supplied through power and ground TSV pairs and power distribution meshes. Accurate estimation of power/ground noises (static and dynamic drops) in a 3-D power distribution network is crucial for a robust power supply design in order to operate the devices functionally. With fast switching characteristics of the devices, the worst case power supply noise may not be analysed accurately. In this paper, we present a systematic approach to analyse the static and dynamic drop, as a function of switching time, in power supply grids of 3-D ICs. Furthermore the approach is extended to investigate noise sensitivity of TSVs and power supply grids with decoupling capacitors.
PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors

Sichen Yang,Ying S. Cao,Hanzhi Ma,Jonghyun Cho,Albert E. Ruehli,James L. Drewniak,Erping Li

DOI: https://doi.org/10.1109/temc.2017.2768226

IF: 2.036

2017-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The power distribution network (PDN) of a high-speed printed circuit board requires a high-performance power supply. The total equivalent inductance above the top ground plane is an important part of PDN design and is regarded as L-above. In this paper, an inductance library for different structures of capacitor connections and capacitor sizes has been built, which is essential for PDN design. computer simulation technology (CST) and partial element equivalent circuit method are applied to obtain the shorted pattern design curves at various design data. The shorted pattern design curve means the total equivalent inductance varies with the distance between pad and ground plane. In addition, an approximate shorted model is established for a decoupling capacitor-mounted model, which will be convenient for us to get the inductance of L-above. In this paper, the design curve provides an intuitive guideline in designing PDN and facilitates the industry to choose what they want with consideration of the inductance, space, via numbers, etc.
Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

EP Li,WL Yuan

DOI: https://doi.org/10.1109/elmagc.2002.1177422

2002-01-01

Abstract:With the advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community, and applications of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering become an emerging technology. Termination, via, and crosstalk on interconnection lines will raise EMI problems in high-speed circuits and will therefore require more attention during the design phase for signal integrity. This paper presents signal propagation effect analysis on high-speed interconnection lines, between different parts, with the finite-difference time-domain method. The mechanisms and effectiveness of control measures are examined, which could be applied to high-speed circuit design.

Research into High Speed PCB Power Integration

Power integrity analysis for high-speed PCB

PCB Layout Optimization of High-Frequency Inverter for Magnetic Coupled Resonance Wireless Power Transfer System

In-package P/G Planes Analysis and Optimization Based on Transmission Matrix Method

Methods and designs for improving the signal integrity for 3D electrical interconnects in high performance IC packaging

Study on the power bus noise isolation using a SPICE compatible method

Analysis of Rectangular Power-Ground Plane Pairs for Noise Suppression

Improved Eigenmode Expansion Method for Investigating of Ground Bounce in Power/ground Plane with Holes in PCBs

Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location

A Novel Electromagnetic Bandgap Design Applied for Suppression of Printed Circuit Board Electromagnetic Radiation

Progress in Research on High-frequency Printed Circuit Boards

PI-EMI co-analysis of ground via effect

Board power bus decoupling using embedded capacitance

Time Domain PDN Noise Modeling for High Performance System

An Efficient Approach for the Power/ground Plane Equivalent Circuit Extraction

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

Achieving Minimal PDN Impedance, SSN and Jitter on PCB with Embedded Capacitance Material

Influence of Decoupling Approach of Power Network on EMC Performance of Digital PCB

Power Integrity Analysis of TSV Based 3-D Integrated Circuits

PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD