Abstract:In this paper, an efficient cascaded microwave network approach is presented for power and signal integrity analysis of multilayer printed-circuit boards (PCBs) and advanced electronic packages with multiple signal traces, multiple power-ground plates, multiple vias, and external loads such as decoupling capacitors. Each parallel-plate pair, which consists of two consecutive conductor plates functioning as either power or ground in the PCBs or packages, is modeled as one individual microwave network. Equivalent circuits are used in the microwave network to model the vias, and a parallel-plate impedance matrix is formulated to account for the wave interactions between the vias and the boundary of the PCB or package. If signal traces are present in a plate pair, a modal decomposition and recombination approach is employed to model two associated modes: the transmission line mode for the signal traces, and the parallel-plate mode for the power-ground plate pair. The microwave networks for each plate pair are finally cascaded together by enforcing the continuity of the voltages and currents at the via clearance holes in the conductor plate shared by two consecutive plate pairs. Numerical validation reveals that the cascaded microwave network approach produces accurate simulation results with much less central processing unit time and memory requirements than 3-D full-wave approaches.

Influence of Decoupling Approach of Power Network on EMC Performance of Digital PCB

Design and Validate the Chip's Power-Network in DSM

On-chip EMC issue: the implementation of patterned ground shields for silicon devices

Equivalent Inductance Analysis and Quantification for PCB PDN Design

A New Method for Power-Aware Signal Integrity Analysis with Spice Model of Power Distribution Network

Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique

The Efficient Equivalent Model for Decoupling Capacitors of Power Distribution Network

Integral-Equation Equivalent-Circuit Method for Modeling of Noise Coupling in Multilayered Power Distribution Networks

Electromagnetic Coupling Between Power Distribution Network and On-chip Inductors in Package

Analysis of Smt Decoupling Capacitor Placement in Electronic Packages Using Hybrid Modeling Method

Time Domain PDN Noise Modeling for High Performance System

Distributed decoupling analysis on PG planes for PDN design

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards with Vias and Decoupling Capacitors

Achieving Minimal PDN Impedance, SSN and Jitter on PCB with Embedded Capacitance Material

Efficient, Simulation of Power Distribution Network by Using Integral-Equation and Modal-Decoupling Technology

Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location

PCB PDN Prelayout Library for Top-Layer Inductance and the Equivalent Model for Decoupling Capacitors

An Efficient Equivalent Circuit Model for the EMC Analysis of Power/Ground Noise

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

PI-EMI co-analysis of ground via effect

Design and modelling of a cost-effective embedded filter for low-impedance power distribution network