Simulation of Temperature Field in the Solidification Process of Cast
Xun Feng Yuan,Rui Xia Hu,Ying Li,Ying Zhou,Lei Li,Lei Wei
DOI: https://doi.org/10.4028/www.scientific.net/amr.1088.834
2015-01-01
Advanced Materials Research
Abstract:The direct difference method is used for solving the heat conduction equation, and simulate the solidification process of T-type cast. The effect of the thermal resistance at cast/mold on distribution of temperature and the solidification rate of corner region is studied. The results show that during the solidification process of T-type, the riser region first solidified, followed by the right half, finally the solidified part was around the corner. With the decrease of the thermal resistance at cast/mold, the temperature of the corner area decreased more quickly and the solidification rate increased. In the actual design process, the material with the good thermal conductivity should be selected for the cast mold to accelerate the solidification rate of the corner region, so the solidification rate of the corner and riser region tend towards harmony, which reducing the formation of various types of defects, and the quality and mechanical properties of the casts were improved.