Abstract:Networks-on-chip (NoC) is emerging as a key on-chip communication architecture for multiprocessor systems-on-chip (MPSoC). In traditional electronic NoCs, high bandwidth can be obtained by increasing the number of parallel metallic wires at the cost of more energy consumption. Optical NoCs are thus proposed to achieve low-power ultra-high-bandwidth data transmission in optical domain. Electronic control technology could be a complement to the optical networks. Besides NoCs, three-dimensional integrated circuits (3D ICs) are another attractive solution for system performance improvement by reducing the interconnect length. The investigation of using 3D IC as a platform for the realization of mixed-technology electronic-con trolled optical NoC has not been addressed until recently. In this paper, we propose a 3D electronic-controlled optical NoC implemented in a TSV-based (through-silicon via) two-layer 3D chip. The upper device layer is an optical layer. It integrates an optical data transmission network, which is responsible for optical payload packets transmission. The bottom device layer is an electronic layer. It contains an electronic control network, which Is used to route control packets and configure the optical network. We built an M mesh-based 3D optical NoC, with a 45nm electronic control network. Power comparison with a matched 2D electronic NoC shows that the optical NoC can reduce power consumption significantly. For 2048B packets, it has a 70% power reduction. End-to-end delay (ETE delay) and network throughput of the two NoCs under varying injection rates were evaluated for comparison. The results show that ETE delay of the optical NoC is much smaller than the electronic NoC when the network becomes congested. Take 4096B packets for example, it is 18.7 mu s in the optical NoC with an injection rate of 0.5, while 33.5 mu s in the electronic one. A maximum throughput of 478Gbps can be offered by the optical NoC using 32Gbps optical link bandwidth. Because of the low resource utilization of circuit switching, the maximum throughput of the optical NoC is slightly lower than the electronic one.

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A High-Performance Low-Power Nanophotonic On-Chip Network

Silicon Photonic Network-on-chip and Enabling Components

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Photonic Integrated Chips for Low-Power, High-Bandwidth Communications

Digital Fourier Transform Spectroscopy: a High-Performance, Scalable Technology for On-Chip Spectrum Analysis

An Inter/Intra-Chip Optical Network for Manycore Processors

Energy-Efficient Hybrid Optical-Electronic Network-On-Chip for Future Many-Core Processors

Device Modeling and System Simulation of Nanophotonic On-Chip Networks for Reliability, Power and Performance

Massively scalable wavelength diverse integrated photonic linear neuron

Multi-dimensional Data Transmission Using Inverse-Designed Silicon Photonics and Microcombs

A Hierarchical Hybrid Optical-Electronic Network-on-Chip

Mode-Division Multiplexing for Silicon Photonic Network-on-chip.

Inverse-designed multi-dimensional silicon photonic transmitters

Edge-guided inverse design of digital metamaterials for ultra-high-capacity on-chip multi-dimensional interconnect

An Open-Source Platform for High-Performance Non-Coherent On-Chip Communication

8 x 8 x 40 Gbps fully integrated silicon photonic network on chip

A Monolithically-Integrated Chip-to-Chip Optical Link in Bulk CMOS

On-chip Photonic Microsystem for Optical Signal Processing Based on Silicon and Silicon Nitride Platforms

Compact Modeling and Circuit-Level Simulation of Silicon Nanophotonic Interconnects.

3d Optical Networks-On-Chip (Noc) For Multiprocessor Systems-On-Chip (Mpsoc)