Optimization of additive formulation for electrolytic copper foil

Guang-bin YI,Tian HE,Xiang-jie YANG,Wen-yi PENG,Fen-min CAI,Hao LU,Zhi-bin YUAN

DOI: https://doi.org/10.3969/j.issn.1001-3849.2010.11.008

2010-01-01

Abstract:Electrolytic copper foils were prepared by direct current electrodeposition at high current density. The electrolyte is mainly composed of Cu2+ 80-90 g/L,H2SO4 120-130 g/L and Cl-30-40 mg/L. The effects of four kinds of additives such as polyethylene glycol (PEG),2-mercapto-benzimidazole (M),thiourea (TU) and gelatin on the mechanical properties of electrolytic copper foil were studied. The optimal formulation is as follows:PEG 0-5.5 mg/L,M 0-6 mg/L,TU 0-3 mg/L,and gelatin 0-4.5 mg/L. The tensile strength and elongation of copper foil at room temperature is 411.3 MPa and 9.3%,respectively,while at high temperature they are 209.2 MPa and 2.9%,respectively.