Aging study of rapidly solidified and solid-solution Cu–Cr–Sn–Zn alloy

Su Juan-hua,Liu Ping,Dong Qi-ming,Li He-jun,Ren Feng-zhang
DOI: https://doi.org/10.1016/j.jmatprotec.2007.11.184
IF: 6.3
2008-01-01
Journal of Materials Processing Technology
Abstract:The effects of different solution methods on aging microstructure and properties of Cu–Cr–Sn–Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu–Cr–Sn–Zn alloy. Under 920°C for 1h solid solution and 500°C aging for 15min, the hardness and electrical conductivity can reach 102HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178HV and 60.6%IACS, respectively.
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