Manufacturing process of reproduction plate by nonmetallic materials reclaimed from pulverized printed circuit boards.

Jie Guo,Jiuyong Guo,Bin Cao,Yinen Tang,Zhenming Xu
DOI: https://doi.org/10.1016/j.jhazmat.2008.07.099
IF: 13.6
2009-01-01
Journal of Hazardous Materials
Abstract:The aim of this study was to present a new method for resource utilization of nonmetallic materials reclaimed from pulverized waste printed circuit boards. A reproduction nonmetallic plate (RNMP) was prepared by adding resin paste, glass fiber and additives into nonmetallic materials using self-made hot-press former. Principle of manufacturing process and effects of mould temperature and moulding time on the mechanical properties of RNMP were studied. The results showed that when moulding pressure was fixed at 6MPa, the optimum conditions for the RNMP were as follows: 140/135°C for top/bottom mould temperature, 5min for moulding time. The maximum content of nonmetallic materials in RNMP was up to 40wt%. When nonmetallic material content was 20wt%, the RNMP moulded at optimum conditions had excellent mechanical properties, with impact strength of 5.8kJ/m2 and flexural strength of 65.1MPa.
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