Spacing selection of lamellar eutectics during directional solidification

Liu Jun-Ming
DOI: https://doi.org/10.1016/0167-577X(92)90195-P
IF: 3
1992-01-01
Materials Letters
Abstract:A new dynamical mechanism of spacing selection of lamellar eutectics (Al-Cu, Sn-Pb and Al-Si systems) during directional solidification is proposed by numerically solving the coupling equation of solidification. In steady-state conditions, one of the lamellar phases has a critical-splitting solidifying interface, while the other is superstable for a regular lamellar array but unstable for an irregular lamellar array. According to this, we obtain scaling laws, which are more general than the classic law of the Jackson-Hunt model, and are supported from measured data for directional solidification of the Al-Si eutectic. The existence of a selection band for the spacings is also discussed.
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