Synthesis and characterization of a novel polytriazole resin with low-temperature curing character

Jianjun Tian,Liqiang Wan,Jianzhi Huang,Yanhong Hu,Farong Huang,Lei Du
DOI: https://doi.org/10.1002/pat.917
IF: 3.348
2007-01-01
Polymers for Advanced Technologies
Abstract:A novel low-temperature curing polytriazole resin was prepared from a triazide and a tetraalkyne and characterized. The resin can be cured at 70 degrees C. The glass transition temperature T-g and thermal decomposition temperature T-d5 of the cured resin with the molar ratio of azide to alkyne group [A]/[B] = 1.0:1.0 reached 324 and 355 degrees C, respectively. The study on the curing kinetics of the resin shows that the apparent activation energy of the curing reaction is 93 kJ mol(-1). The flexural strength of the cured resin reached 137.6 MPa at room temperature and 102.6 MPa at 185 degrees C. Copyright (c) 2007 John Wiley & Sons, Ltd.
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