Modelling of Microspring Thermal Actuator

JK Luo,AJ Flewitt,SM Spearing,NA Fleck,WI Milne
2004-01-01
Abstract:A new type of Microspring (mu-spring) electrothermal actuator consisting of multi-chevron structures was proposed. Finite element analysis was used to model the device performance, and the results compared with that of chevron thermal actuator. The simulation showed that the mu-spring actuator can deliver a much large deflection than that of chevron actuator. The deflection is proportional to the number of chevron structures linked together. By linking more chevron structures, this mu-spring can deliver a larger displacement than any other thermal actuators. The device has a much smaller footage than that of a single chevron device for a similar amount of deflection. Electroplated Ni thin film and SiO2 were used as active and linkage materials to fabricate the mu-spring actuator.
What problem does this paper attempt to address?