Abstract:With the development of integrated circuit packaging technology, ultrasonic scanning detection technology is more and more widely used in the semiconductor industry. From chips to various MEMS electronic packaging devices, they can be used to detect their internal defects. This paper introduces the basic principle of ultrasonic scanning microscope system used to detect multilayer structure and the key technology of defect judgment. This includes a phase judgment algorithm based on the amplitude variation of A-scan waveform and the principle of phase inversion. By marking layered defects, the algorithm can generate scanned images with real defect shapes, which improves the efficiency of manual analysis. In this paper, several multilayer devices and the corresponding A-scan waveforms are used to verify the algorithm. This paper also includes the statistical method of defects based on blob analysis. This paper analyzes the defects according to the characteristic parameters of the connection area, and summarizes a set of defect statistical methods, which can obtain the target defect information statistics and determine the number, size, area and other information of defects. In addition, this paper also proposes an image interpolation method suitable for ultrasonic scanning. Experiments show that this method can improve the scanning efficiency about twice while ensuring the image clarity. This paper provides a theoretical basis for the detection method of multilayer chip, and also provides a reference for the actual production practice.

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