A Hybrid 2-D ADI-FDTD Subgridding Scheme for Modeling On-Chip Interconnects

BZ Wang,YJ Wang,WH Yu,R Mittra

DOI: https://doi.org/10.1109/6040.982840

2001-01-01

IEEE Transactions on Advanced Packaging

Abstract:This paper presents a novel technique for extracting the propagation characteristics of on-chip interconnects. A hybrid two-dimensional subgridding scheme, based on a combination of the finite-difference time-domain (FDTD) method and the alternating-direction implicit (ADI-)FDTD technique, is utilized. The ADI-FDTD scheme is used for fine grid in the vicinity of the metallic etch, while the coarse FDTD grid is used outside this region. The advantage of the ADI-FDTD scheme is that it can be synchronized with the time marching step employed in the coarse FDTD scheme, obviating the need for the temporal interpolation of the fields in the process. This helps to render the hybrid ADI-FDTD subgridding scheme to be more efficient than the conventional FDTD subgridding algorithm in terms of the run time. The phase and attenuation constants of the dominant mode of a lossy stripline are computed by the proposed scheme to validate the technique