Research on Transient Liquid Phase Diffusion Bonding Process of TiNi Shape Memory Alloy to Stainless Steel

WANG Ying-ling,LI Hong,LI Zhuo-xin,FENG Ji-cai
DOI: https://doi.org/10.3969/j.issn.1001-4381.2008.09.013
2008-01-01
Journal of Materials Engineering
Abstract:Transient liquid phase diffusion bonding(TLP-DB) of TiNi shape memory alloy(SMA) to stainless steel was performed with AgCu foil as interlayer.The effect of bonding temperature,holding time and bonding pressure was also investigated.The results showed that the maximum shear strength of the joint was obtained for the specimens joined at 860℃ for 60 minutes with a specific pressure of 0.05MPa.Through scanning electron microscopy(SEM) and X-ray diffractometry(XRD) test,the element distribution and phase composition of the joint welded under the optimum process parameters were investigated.It indicated that the joint property was significantly influenced by the formation of intermetallics TiNi2,TiFe and Ti3Ni4 etc.
What problem does this paper attempt to address?