Properties of amorphous SiO2 films prepared by reactive RF magnetron sputtering method

Le-Nian He,Jin Xu
DOI: https://doi.org/10.1016/S0042-207X(02)00388-3
IF: 4
2002-01-01
Vacuum
Abstract:Amorphous SiO2 (a-SiO2) films were prepared by reactive RF magnetron sputtering method in an oxygen and argon mixture at room temperature. The chemical structure and electrical properties of the films were investigated as a function of the gas volume ratio [O2]/[Ar]. When Ar was fixed at 40sccm and O2 was increased, deposition rate would decrease firstly, then increase and finally decrease. When the [O2]/[Ar] ratio was larger than 0.075, oxide films having a stoichiometric composition can be obtained. With increasing [O2]/[Ar], the resistivity and breakdown strength of electric field for the films increased, while buffered HF etch rate decreased. Neither absorption bands due to H–OH bonds in Fourier-transform spectra, nor porosity detected by electronic scan microscope was found in all films. It was suggested that the films were densified and had good dielectric properties.
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