Abstract:Interface interaction can strongly modify contact angle, adsorption energy, interfacial tension, and composition of the contact area. In particular, the interfaces between gallium-based liquid metal (LM) and its intermetallic layer present many mysterious and peculiar wetting phenomena, which have not been fully realized up to now. Here in this study, we found that a gallium-based liquid metal droplet can quickly transform into a puddle on the CuGa2 surface through a spreading wetting procedure. The mechanism lying behind this phenomenon can be ascribed to the formation of an intermetallic CuGa2 on Cu plate surface, which provides a stable metallic bond to induce the wetting behavior. For a quantitative evaluation of the interface force, a metallic bond-enabled wetting model is established on the basis of the density functional theory. The first-principles density functional calculations are then performed to examine the work function, density of states, and adsorption energy. The predicted results show that the work function of CuGa2 (010) is approximately 4.47 eV, which is very comparable with that of pure liquid Ga (4.32 eV). This indicates that the valence electrons between Ga and CuGa2 slab can exchange easily, which consequently leads to the strong valence electron hybridization and metallic bond. In addition, the adsorption energy of a single Ga atom on CuGa2 (010) slab has a larger value than In and Sn. The tested metallic bond wetting force at the interface is proportional to the average adsorption energy of the gallium-based LM adatom, and increases with the rising content of gallium. The simulation results demonstrate excellent consistency with the experimental data in this work.

Wetting phenomena in CuZr-based glassy alloys/W system

The characterisation of atomic structure and glass-forming ability of the Zr–Cu–Co metallic glasses studied by molecular dynamics simulations

EFFECTS OF THE ADDITION OF Ti OR Al ON THE WETTING BEHAVIORS AND INTERFACIAL CHARACTERISTICS OF Zr 50 Cu 50 BULK METALLIC GLASS/W SUBSTRATE

Wetting Behavior and Interface Characteristic of Ti<sub>32.8</sub>Zr<sub>30.2</sub>Ni<sub>5.3</sub>Cu<sub>9</sub>Be<sub>22.7</sub>/Ti6Al4V

The Anxieties of Globalization:

Renal transplantation in children younger than 6 years old.

Mechanism of Ag and Al on improving the glass forming ability of CuZr-based alloys

Effect of microalloying on wettability and interface characteristics of Zr-based bulk metallic glasses with W substrate

Design Of Cu8zr5-Based Bulk Metallic Glasses

Hyperinsulinism in obese diabetic Pima Indians.

Glass Forming Abilities of Binary Cu100−xZrx (34, 35.5, and 38.2 At. %) Metallic Glasses: A LAMMPS Study

Glass Forming Ability and Crystallization of Zr–Cu–Ag–Al–Be Bulk Metallic Glasses

Reaction Induced Anomalous Temperature Dependence of Equilibrium Contact Angle of TiZr Based Glass Forming Melt on Al2O3 Substrate

Atomic Structure and Glass Forming Ability of Cu46zr46al8 Bulk Metallic Glass

Elastic Properties and Glass Forming Ability of the Zr$_{50}$Cu$_{40}$Ag$_{10}$ Metallic Alloy

Zr–(Cu,Ag)–Al Bulk Metallic Glasses

Metallic Bond-Enabled Wetting Behavior at the Liquid Ga/CuGa2 Interfaces

The Correlation among the Atomic Structure, Electronic Valence Band and Properties of Zr-Cu-Al-Ag Bulk Metallic Glasses

Molecular dynamics simulation of minor Zr addition on short and medium-range orders of Cu-Zr metallic glass

Interfacial Free Energy Controlling Glass-Forming Ability of Cu-Zr Alloys.

Atomic structure and energetics of amorphous–crystalline CuZr interfaces: a molecular dynamics study