Abstract:1-Octadecanethiol (C18SH) monolayers were self-assembled on the fresh and active copper surface pretreated by nitric acid etching method. The surface properties of the alkanethiol-modified copper electrode in halide-containing solutions were characterized systematically by using several electrochemical methods, including polarization curves, cyclic voltammetry, electrochemical impedance spectroscopy (EIS) and electrochemical noise (EN). The results show that C18SH self-assembled monolayers (SAMs) onto copper provide a flexible method that can protect the underlying copper against corrosion. With the immersion time of SAMs-coated copper electrode in NaCl and HCl corrosive solutions increasing, a slow loss of corrosion protection ability of SAMs indicates dynamic processes occurring at the electrode/solution interface and in the monolayers, such as expansion of the defects and transport of corrosive ions through defects of SAMs. Electrochemical noise (EN) is employed to detect the alkanethiol-modified copper surfaces immersed in HCl solution. This observation suggests the pitting process associate with dynamic processes in the 1-octadecanethiol layer.

Study on Behavior of Docecanethiol SAMs on Pure Copper Surface

Self-assembling behavior and inhibition effect of dodecanethiol self-assembled monolayers on copper surface

Investigation on Assembling Behavior of Dodecanethiol SAMs on Copper Surface Based on Multifractal Spectrum

Corrosion Protection of Copper by Self-Assembled Monolayers Modified in Aqueous Micellar Solution

Studies on corrosion inhibition of copper by alkanethiol SAMs prepared in aqueous micellar solution

Protection of Copper Corrosion by Modification of Dodecanethiol Self-Assembled Monolayers Prepared in Aqueous Micellar Solution

Electrochemical and Anti-Corrosion Properties of Octadecanethiol and Benzotriazole Binary Self-Assembled Monolayers on Copper

An Impedance Investigation of Corrosion Protection of Copper by Self-Assembled Monolayers of Alkanethiols in Aqueous Solution

Electrochemical characterization of copper surface modified by n-alkanethiols in chloride-containing solutions

Inhibition of Copper Corrosion by Modifying Cysteine Self‐assembled Film with Alkylamine/alkylacid Compounds

Inhibition Effect of Three-Dimensional (3D) Nanostructures on the Corrosion Resistance of 1-Dodecanethiol Self-Assembled Monolayer on Copper in NaCl Solution

Inhibition of Copper Corrosion in Sodium Chloride Solution by the Self-Assembled Monolayer of Sodium Diethyldithiocarbamate

Inhibition Action of the Self-Assembled Monolayers of P-hydroxybenzoic Acid on Copper

Electrochemical Investigation of Dynamic Interfacial Processes at 1-Octadecanethiol-modified Copper Electrodes in Halide-Containing Solutions

Influence of Oxygen and Oxidant on Corrosion Inhibition of Cysteine Self-Assembled Membranes for Copper

Corrosion Inhibition of Octadecanethiol Self-assembly Monolayers on Silver

Protection of self-assembled monolayers formed from triethyl phosphate and mixed self-assembled monolayers from triethyl phosphate and cetyltrimethyl ammonium bromide for copper against corrosion

Anticorrosion Action of Serf-assemble Monolayers on Bronze in Aqueous Solution

Anticorrosion action and adsorption mechanism of the self-assemble monolayers on silver in aqueous solution

A Sulphuric Solution Inhibitor Containing Dithiocarbamate and Its Anti-corrosion Effect on Copper

Inhibition of Copper Corrosion by the Formation of Schiff Base Self-Assembled Monolayers