Design of Micro-gripper in Wire Bond Based on Piezoelectric Material

Zhili Long,Mouyang Liu,Jianguo Zhang
DOI: https://doi.org/10.3969/j.issn.1004-2474.2012.06.012
2012-01-01
Abstract:Micro-gripper is a key component in IC/LED wire bonder.A nonnative gripper combined with piezoelectric material and flexible structure is presented in this paper.The vibration modal and static characteristics of this gripper are calculated by finite element method.The natural frequency and vibration modal of the system;and the open amplitude of this gripper are attained.In the experiment,the high-speed camera is used to track the vibration of the gripper,and the relationship between the open amplitude and the driven voltage is attained.The vibration behavior is collected by a non-contact laser to verify the FEM calculations.These results can help to the application of this gripper used in wire bond.
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