Simulation and Study on Indirectly-heated MEMS Microwave Power Sensor

LIAO Xiao-ping,FAN Xiao-yan
DOI: https://doi.org/10.3969/j.issn.1002-1841.2006.03.002
2006-01-01
Abstract:The indirectly-heated terminating type MEMS microwave power sensor's structure and process were presented,and based on these,the match design among the coplanar waveguide,the terminal resistors and the thermopile were done.Using HFSS,the simulation results were attained,including the matching between the pads and the CPW,the relation between the output of the thermopile and the number of the thermocouples,and the impact of approach of the thermopile on the CPW.Based on these simulation results,specify the distance between the pads and the CPW is 150 μm,the number of the thermocouple is 50,the distance between the CPW and the thermopile is 50 μm.GaAs and Au are chosen as arms of the thermopile,and TaN as the terminal resistor.
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