Study on curing kinetics of epoxy resin structure adhesive for vehicle

Zhu Dongling,Yu Qiang,Lin Xin,Zhang Junying,Cheng Jue
DOI: https://doi.org/10.3969/j.issn.1004-2849.2011.06.004
2011-01-01
Abstract:The curing kinetics of Sikapower-492G-type EP(epoxy resin) structure adhesive for vehicle was investigated in the dynamic heating process by non-isothermal DSC(differential scanning calorimetry).According to DSC curves at different heating speeds,the kinetic parameters of EP adhesive were obtained by Kissinger method,Crane method,Ozawa method and temperature-heating speed(T-β) extrapolation.The results showed that the curing kinetics of this EP adhesive system could be characterized by first order curing kinetics model.The gelling temperature,curing temperature and post-treatment temperature of the EP adhesive were about 123,164,224 ℃ respectively.And some kinetic parameters such as the apparent activation energy,frequency factor and reaction order of the EP adhesive were 117 kJ/mol,1.80×1013 s-1 and 0.938 respectively.
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