Abstract:Understanding the role of alkylamine surfactants in the anisotropic growth mechanism of copper nanowires (CuNWs) in solution-phase synthesis has implications for tuning of the properties that can be employed in diverse, important applications. In this paper, we used molecular dynamics simulations to show that the hexadecylamine (HDA) adsorption structure can, depending on the HDA density, form a surfactant monolayer or many stacked layers parallel to the copper surface. We showed that the layers are similar on the Cu(111) and Cu(100) facets, independent of the HDA density, and that the presence of Cl– ions appears to have no significant effect on the HDA/HDA+ stacked layer structure. Within the simulation time frame, Cl– ions do not pass through a regular, uniform HDA monolayer, but they can pass through a monolayer with some protonated HDA molecules (HDA+). Our results suggest that Cl– ions not only affect the HDA/HDA+ monolayer stability in CuNW synthesis, causing a disruption of the monolayer and formation of the stacked layer, but also participate in copper(II) alkylamine complex formation. Moreover, our results stress the importance of a reliable model of the surfactant layer on the metal particle, explicitly considering the protonation of part of the surfactant. Our results show a completely innovative perspective of the HDA adsorption structure and its role in the growth mechanism of CuNWs in solution-phase synthesis, allowing improvements in control of the properties and the quality of the CuNWs obtained.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsanm.0c00708?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsanm.0c00708</a>.Density profiles of HDA and water molecules for HDA adsorption at higher and lower densities on the Cu(111) surface, of HDA for adsorption at lower densities on the Au(100) surface, of water and Cl– on the Cu(111) surface at a lower HDA/HDA+ density on Cu(111), and of water and HDA/HDA+ at higher densities on the Cu(100) and Cu(111) surfaces and a minimum distance between the Cl– ions that penetrate the monolayer on the Cu(111) surface and analyses of the potential, kinetic, and total energies as a function of time and of interaction energies involving chosen molecules throughout the simulation (<a class="ext-link" href="/doi/suppl/10.1021/acsanm.0c00708/suppl_file/an0c00708_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.

Adsorption behavior of dodecylamine on copper–nickel alloy surface in NaCl solutions studied by electrochemical methods and AFM

Adsorption Performances for Aqueous Cu(II) onto Chelating Resin Dowex M-4195: Interaction Mechanism Investigation

Investigation of Corrosion Inhibitor Adsorption on Mica and Mild Steel Using Electrochemical Atomic Force Microscopy and Molecular Simulations

Adsorption of divalent heavy metal ions onto IDA-chelating resins: simulation of physicochemical structures and elucidation of interaction mechanisms.

Adsorption of Platinum(iv) and Palladium(ii) from Aqueous Solution by Magnetic Cross-Linking Chitosan Nanoparticles Modified with Ethylenediamine.

Adsorption behavior of dodecylbenzyldimethyl ammonium bromide on iron surface and its synergistic inhibition effect on cinnamaldehyde in hydrochloric acid

Study on corrosion inhibition performance of 1-dodecyl-3-methyl-1 h-imidazolium nitrate on Cu in the sulfuric acid environment

Adsorption Performances and Mechanisms of the Newly Synthesized N,N '-Di (carboxymethyl) Dithiocarbamate Chelating Resin Toward Divalent Heavy Metal Ions from Aqueous Media

Effect of Additive Methyl Nicotinate on Electrochemical Behavior of Nickel–Copper Alloy Electrodeposition in ChCl-EG Deep Eutectic Solvents

Molecular Dynamics Simulations of the Structural Arrangement and Density of Alkylamine Surfactants on Copper Surfaces: Implications for Anisotropic Growth of Copper Nanowires

Self-assembled monolayer of ammonium pyrrolidine dithiocarbamate on copper detected using electrochemical methods, surface enhanced Raman scattering and quantum chemistry calculations

Inhibition of Copper Corrosion in Sodium Chloride Solution by the Self-Assembled Monolayer of Sodium Diethyldithiocarbamate

Adsorption behavior and corrosion inhibition performance of tetrazolium derivatives on electrolytic copper foil surface

Assessment of Anti-corrosion Behavior of Three Triazolyl Schiff Bases in 3.5 wt% NaCl Solution: Experimental and Theoretical Approaches

Acetylcholine and Rivastigmine as Corrosion Inhibitors of Cu – Sn - Zn – Pb Alloy in Hydrochloric Acid Environment: DFT & Electrochemical Approach

Corrosion inhibition of AA2024-T3 in alkaline solution by disodium-N-dodecyliminodiacetate: Experimental and theoretical studies

Definitions revisited.

Temporal Aspects of Corrosion Inhibition on Copper, Silver, and Copper-Silver Alloy: An Electrochemical Impedance Spectroscopy Study

Electrochemical Impedance and X-ray Photoelectron Spectroscopic Studies of the Inhibition of Mild Steel Corrosion in Acids by Cyclohexylamine

Experimental and theoretical studies of sodium acetyldithiocarbamate for the removal of Cu2+ and Ni2+ from aqueous solution

Electrochemical behavior and theoretical studies of arylazo (1-naphthyl-2-cyanoacetamide) derivatives as new corrosion inhibitors for Inconel 800 in chloride solution