A New Cooling Process for Soft Contact Electromagnetic Confinement and Directional Solidification of Special Alloys

ZHANG Feng-shou,SHENG Jun,HE Yue-hui,FU Heng-zhi,LIU Lin
DOI: https://doi.org/10.3969/j.issn.1005-0299.2007.04.001
IF: 1.8
2007-01-01
Materials Science and Technology
Abstract:On the basis of studying the characteristics of heat transfer in the fluidized bed,the new cooling process for directional solidification of special alloys under vacuum is presented,and the appropriate process parameters are elected.The results show that temperature gradient 260 K/cm in the S/L and the near blade samples of superalloy with solidified structure first dendrite arm spacing 60 μm are obtained by soft contact electromagnetic confinemeng and directional solidification under liquid nitrogen pressure 0.3 Pa,100# SiC particle,using the distance 10 mm between ejection and thermal baffle process scheme and drawing velocity 9 mm/min condition.
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