Strain Rate Dependence of Tensile Ductility in an Electrodeposited Cu with Ultrafine Grain Size

Hanzhuo Zhang,Zhonghao Jiang,Hanshe Lian,Qing Jiang
DOI: https://doi.org/10.1016/j.msea.2007.06.027
IF: 6.044
2007-01-01
Materials Science and Engineering A
Abstract:Tensile behavior of an electrodeposited Cu with ultrafine grain size of ∼200nm was studied at different strain rates and room temperature. By increasing the strain rate the elongation to fracture increased noticeably. Analysis on the deformed and fracture surfaces suggested a shear localization process in the necking stage, which led to a different tendency of cracking. Strong strain rate dependences of work hardening and shear localization might be responsible for variation of the tensile ductility.
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