New considerations for the fracture of piezoelectric materials under electromechanical loading

B.L. Wang,J.C. Han,S.Y. Du
DOI: https://doi.org/10.1016/S0093-6413(00)00115-4
IF: 2.749
2000-01-01
Mechanics Research Communications
Abstract:The fracture mechanics problem for a finite height piezoelectric medium under inplane electromechanical loading was studied. This problem was reduced to the solution of singular integration equations by using the Fourier transforms technique. Numerical results demonstrate the effects of crack size and crack position on the stress and electric displacement intensity factors for different crack face boundary condition assumptions.
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