Design of a UWB LTCC T/R Module

ZHAO Bo-tao,SHEN Da-li,WANG Zhi-gang,XU Rui-min,XIE Jun

2010-01-01

Abstract:A UWB LTCC T/R module design is described in this paper.Analyzing the indexes of the T/R,the feasible chip was chosen,and the scheme was optimized.Based on the scheme design,the integrated design was simulate and realized.The simulation results from 18-40GHz satisfied the design specification well.

What problem does this paper attempt to address?

A Compact 2-18Ghz Ultra-Wideband Frequency-conversion T/R Module Based on a 3D Heterogeneous Integrated Process

Jing Sun,Lili Dang,Bing Zhang,Kaijiang Xu,Chao Luo,Fuhai Zhao,Zhiyu Wang,Jiarui Liu,Hua Chen,Faxin Yu

DOI: https://doi.org/10.1587/elex.21.20240209

2024-01-01

IEICE Electronics Express

Abstract:In this letter, a compact 2-18GHz ultra-wideband frequencyconversion transmit/receive (T/R) module based on a three-dimensional heterogeneous integration (3DHI) process is designed and fabricated. An ultra-wideband impedance matching method is introduced to address the structural discontinuities within the 3D interconnections. Through silicon via (TSV) shielding and cavity designs are leveraged to reduce the impact of local oscillator (LO) leakage. The compact module consists of stacked four-layer silicon interposers and two-layer embedded chips is employed by a 3DHI process with wafer-to-wafer (W2W) bonding, the dimensions of which is only 10.1mmx10.1mmx1.0mm. The measured results show that the saturated output power reaches 19dBm at 2GHz and 16.9dBm at 18GHz, and the rejection of image frequencies exceeds 70dBc.
W Band Substrate-Integrated Slot Antenna-In-Package Using Higher Order Mode

En Zhang,Liang Zhou,Wen-Yan Yin

DOI: https://doi.org/10.1109/APUSNCURSINRSM.2019.8888951

2019-01-01

Abstract:This study presents the design of substrate-integrated slot antenna based on the TE20 mode. The conductance of a slot is calculated using a TE20 mode rectangular waveguide. A 94 GHz antenna is designed using benzocyclobutene for the package to validate the conductance calculations. Conductance is compared at different substrate-integrated waveguide thicknesses. The 94 GHz slot antenna has a gain of 7.2 dBi. Simulated and measured results have been compared. The antenna in package can be further interconnected and integrated with other active devices to demonstrate a three-dimensional integration.
AN OVERALL LTCC PACKAGE SOLUTION FOR X-BAND TILE T/R MODULE

Zhong-Jun Yu,Zheng Xu,Yun-Kai Deng,Zhi-Guang Zhang

DOI: https://doi.org/10.2528/pierl13011009

2013-01-01

Progress In Electromagnetics Research Letters

Abstract:An overall Low-Temperature Co-fired Ceramics (LTCC) package solution for X-band T/R module has been presented in this paper. This tile type package contributes to a dramatic reduction in size and weight of the T/R module. Moreover, an obvious merit of ceramic housing is better consistency of Coefficient of Thermal Expansion (CTE), compared with the traditional combination of ceramic board and metal housing. The schematic diagram and 3-D structure of the T/R module have been presented and a novel vertical interconnection based on Ball Grid Array (BGA) has been proposed to connect vias in the lid and those in the stage of the main LTCC pan. The LTCC T/R module has been fabricated and measured. It is compact in size (20 x 20 x 2.6 mm(3)) and has a weight of 3.5 g. The measured transmit output power is 33 +/- 1 dBm in the frequency range from 8.8 GHz to 10.4 GHz, and the measured receive gain and Noise Figure are 29-30.5 dB and 2.6-2.8 dB, respectively.
UWB Radio Module Design for Wireless Intelligent Systems-From Specification to Implementation

meigen shen,tero koivisto,teemu peltonen,lirong zheng,esa tjukanoff,hannu tenhunen

DOI: https://doi.org/10.1109/HDP.2005.251423

2005-01-01

Abstract:In this paper, we designed an impulse-based ultra wideband (UWB) radio module (low band) for wireless intelligent system applications such as radio frequency identification (RFID) and wireless sensor networks (WSN). The UWB radio module includes transceiver block, baseband process unit and power management block. The transceiver circuits include Gaussian pulse generator, wideband low noise amplifier (LNA), multiplier, integrator and timing circuits, which use 0.18mum, 1P6M CMOS technology. The wideband LNA has a power gain of 10dB and minimum noise figure of 2.7dB. For UWB transceiver, the power consumption of transmitter is lower than 1mW while the receiver is about 23mW. The liquid-crystal-polymer (LCP)-based system-on-package (SoP) technology is used to implement the UWB radio module for low power, low cost and small size
The design and fabrication of RF band pass filter by LTCC technology

Yuanxun Li,Yingli Liu,Huaiwu Zhang,Dafu Lu,Lifei F. Bian,ZongBao Yang

DOI: https://doi.org/10.1109/ICEPT.2008.4607080

2008-01-01

Abstract:LTCC (low temperature co-fired ceramics) has been become the key technology of packaging for the integrated of RF passive components due to its higher performance of thermal sink, reliability and plays an important role in increasing higher frequency, decreasing the loss, minimize the volume, etc. This paper mainly focuses on the design and fabrication of RF band pass filter by LTCC technology. The filter model was established according to the capacitor coupled resonate band-pass filterpsilas circuit structure and the connect type of embedded coupling capacitor was neatly designed to make it be linked between in port an out port, for two translations zeros using two stage resonator can be produced. After tuning up the distances between the strip line inductor and ground to adjust the inductance and quality Q, the circuitpsilas whole performance could be improved. The band-pass filters with center frequency separated at 1.8 GHz and 1.3 GHz were fabricated using ULF140 material as the dielectrics to further validate the model and the samples were tested with high consistence with the simulated data.
Design of a Ka-Band Heterogeneous Integrated T/R Module of Phased Array Antenna

Qinghua Zeng,Zhengtian Chen,Mengyun He,Song Wang,Xiao Liu,Haitao Xu

DOI: https://doi.org/10.3390/electronics13010204

IF: 2.9

2024-01-03

Electronics

Abstract:The central element of a phased array antenna that performs beam electrical scanning, as well as signal transmission and reception, is the transceiver (T/R) module. Higher standards have been set for the integration, volume, power consumption, stability, and environmental adaptability of T/R modules due to the increased operating frequency of phased array antennas, the variability of application platforms, and the diversified development of system functions. Device-based multichannel T/R modules are the key to realizing low-profile Ka-band phased array antenna microsystem architecture. The design and implementation of a low-profile, high-performance, and highly integrated Ka-band phased array antenna T/R module are examined in this paper. Additionally, a dependable Ka-band four-channel T/R module based on Si/GaAs/Low Temperature Co-fired Ceramic (LTCC), applying multi-material heterogeneous integration architecture, is proposed and fabricated. The chip architecture, transceiver link, LTCC substrates, interconnect interface, and packaging are all taken into consideration when designing the T/R module. When compared to a standard phased array antenna, the module's profile shrunk from 40 mm to 8 mm, and its overall dimensions are only 10.8 mm × 10 mm × 3 mm. It weighs 1 g, and with the same specs, the single channel volume was reduced by 95%. The T/R module has an output power of ≥26 dBm for single-channel transmission, an efficiency of ≥25%, and a noise factor of ≤4.4 dB. When compared to T/R modules based on System-on-Chip (SOC) devices, the RF performance has significantly improved, as seen by an increase in single channel output power and a decrease in the receiving noise factor. This work lays a foundation for the devitalization and engineering application of T/R modules in highly reliable application scenarios.

engineering, electrical & electronic,computer science, information systems,physics, applied
Design of On-Chip Dual-Band Bandpass Filter Using Lumped Elements in LTCC Technology

Liwei Hao,Yongle Wu,Weimin Wang,Yuhao Yang

DOI: https://doi.org/10.1109/tcsii.2021.3113790

2022-03-01

Abstract:In this brief, a novel on-chip dual-band bandpass filter (D-BPF) with two independently controllable transmission zeros (TZs) is proposed. Based on resonators transformation, the schematic and design procedure of the filter are presented. Using even-/odd-mode analysis, analytical equations are used for demonstration of the theory. As an example, a 3.32/5.17-GHz D-BPF with 3-dB fractional bandwidth (3-dB FBW) of 25.45%/14.20% for 5G applications is designed, fabricated, and measured. The size of the filter in low-temperature cofired ceramic (LTCC) is only 11.4 mm * 6 mm * 0.94 mm. The filter has been successfully measured with the minimum insertion loss of 1.38/1.53-dB and high return loss of 28/23-dB at the center frequency.
Design of LTCC Wilkinson power divider for microwave modules

HU Songsong,LIU Yingli,ZHANG Huaiwu,ZHAO Hai

DOI: https://doi.org/10.3969/j.issn.1001-2028.2011.01.014

2011-01-01

Abstract:Based on LTCC technology,a new kind of 3D Wilkinson power divider was designed for microwave modules.The operating frequency range,insert loss(IL),isolation and voltage standing wave ration(VSWR) of the power divider were designed to be 2.2-2.7 GHz,below 0.5 dB,above 20 dB and below 1.3,respectively.A model was built for the power divider using the HFSS software and the properties of the power divider were simulated.The simulation results show that,within the operating frequency range,the IL,isolation and VSWR of the power divider are below 0.30 dB,above 20 dB and below 1.25,respectively.This indicates that the performance of the power divider fulfill the design requirements.
Design and fabrication of 2.45G miniaturized band pass filter by LTCC technology

Chen, Daming,Yingli Liu,Yuanxun Li,Wenguo Zhong,Dafu Lu

DOI: https://doi.org/10.1109/ICEPT.2010.5582800

2010-01-01

Abstract:With the rapid development of wireless communication systems and personal consumer electronics, it is intensely necessary for RF-products to be more and more multifunctional and miniaturized. The low-temperature co-fired ceramics (LTCC) technology which has 3-D integration capabilities and low cost is usually used to fabricate miniaturized multilayer RF passive components. As one of the most important passive components in RF wireless transceiver system, the band pass filter (BPF) has attracted significant interest in 3-D miniaturized design. [1, 2]. As we known,an excellent BPF must have low pass-band insertion loss and large out-of-band rejection. In this paper, a 2.45G miniaturized band pass filter, which incorporates a feedback capacitor between input and output to realize two finite transmission zero has been optimized by Ansoft HFSS. After the physical model and inner structure of the BPF are established, the samples are fabricated by LTCC technology. Testing results show that the insertion loss is less than 5.2dB and return loss is less than -13dB at the center frequency of 2.6GHz, which agree basically with the simulation results.
DESIGN OF AN ULTRA-WIDEBAND (UWB) HTS FILTER IN UHF-BAND

CHEN Wei,GUO Xu-bo,CAO Bi-song,ZHANG Xiao-ping,WEI Bin,ZHANG Ying,LU Xin-xiang

2009-01-01

Abstract:In this paper, we present the design and fabrication of an ultra-wideband (UWB) bandpass HTS filter using quarter-wavelength shunt-stub. The filter structure is improved to miniature the filter size. An UWB filter with a fractional bandwidth of 87% at 785 MHz is designed and fabricated. The measured results show an insertion loss of less than 0. 21dB, a return loss of better than 15.6dB, out of band rejection higher than 65dB, and the rectangle coefficient of 1.3 without tuning. Furthermore, the measured results are in good agreement with the simulated ones.
Co-design of ESD Protection and UWB RF Front-End ICs

Xin Wang,He Tang,Lin,Jian Liu,Qiang Fang,Hui Zhao,Albert Wang,ZiTao Shi,SiQiang Fan,Bin Zhao,LiWu Yang,Jun He,YuHua Cheng

DOI: https://doi.org/10.1007/s11432-011-4416-3

2011-01-01

Science China Information Sciences

Abstract:This paper discusses critical aspects for co-design of ultra wideband (UWB) system-on-chip (SoC) and on-chip electrostatic discharge (ESD) protection, which are beyond the considerations on data rate and bandwidth. Impulse radio UWB system architecture has been defined with critical building blocks proposed and verified, including pulse generator, transmitter, low noise amplifier (LNA) and multiplier based correlator. ESD protection is well considered for each related block. Design examples have been implemented in a commercial RFCMOS processes to demonstrate the working principles for key UWB transmitter and receiver circuit blocks. UWB-ESD co-design techniques, simulation and measurement results for these UWB RF modules are presented in detail.
Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging

Faxin Yu,Qi Zhou,Zhiyu Wang,Jiongjiong Mo,Hua Chen

DOI: https://doi.org/10.3390/electronics10161893

IF: 2.9

2021-01-01

Electronics

Abstract:In this paper, a three-dimensional heterogenous-integrated (3DHI) wafer-level packaging (WLP) process is proposed, and a radio frequency (RF) front-end module with two independent ultra-high frequency (UHF) receiving channels are designed and implemented, which covers 400 MHz-600 MHz and 2050 MHz-2200 MHz respectively for unmanned aerial vehicle (UAV) applications. The module is formed by wafer-to-wafer (W2W) bonding of two high-resistivity silicon (HR-Si) interposers with embedded bare dies and through silicon via (TSV) interconnections. Double-sided deep reactive ion etching (DRIE) and conformal electroplating process are introduced to realize the high-aspect-ratio TSV connection within 290 p.m-thick cap interposer. Co-plane waveguide (CPW) transmission lines are fabricated as the process control monitor (PCM), the measured insertion loss of which is less than 0.18 dB/mm at 35 GHz. The designed RF front-end module is fabricated and measured. The measured return loss and gain of each RF channel is better than 13 dB and 21 dB, and the noise figure is less than 1.5 dB. In order to evaluate the capability of the 3DHI process for multi-layer interposers, the module is re-designed and fabricated with four stacked high-resistivity silicon interposers. After W2W bonding of two pairs of interposers and wafer slicing, chip-to chip (C2C) bonding is applied to form a four-layer module with operable temperature gradient.
Design of miniaturized short wave tunable bandpass filter with wide tuning range based on LTCC technology

Bao-lin ZHAO,Yu SHI,Wei-wei QIN,Dong-ming ZHANG

DOI: https://doi.org/10.3969/j.issn.1001-3830.2014.03.009

2014-01-01

Abstract:A miniaturized short wave tunable bandpass filter with 220% tuning range based on improved axial-coupling electrically tuning filter circuit and low-temperature co-fired ceramic(LTCC) technique is proposed.The design is realized by only four embedded inductors and several surface mount technology(SMT) varactors.Compared to that of the traditional tunable filter,the numbers of components used in the circuit of tunable filter are reduced and the tuning range of filter is increased by 100%.Based on the LTCC technology,the consistency and reliability of this design is improved.The tunable filter only occupies 12.5×8×1.2mm3.The measured results are in good agreement with the electromagnetic(EM) simulation.
DESIGN AND TRIMMING METHOD OF A P-BAND HTS ULTRA-WIDEBAND (UWB) FILTER USING SHUNT-STUB STRUCTURE

CHEN Wei,GUO Xu-bo,ZHANG Xiao-ping,WEI Bin,CAO Bi-song,ZHANG Ying,LU Xin-xiang

2010-01-01

Abstract:In this paper,an HTS UWB filter with passband from 250 MHz to 480 MHz is designed and fabricated. We improve the quarter-wavelength shunt-stub structure to reduce the filter size and make tuning feasible. Without tuning,the measured results show an insertion loss less than 0.3 dB,a return loss better than 10.9 dB,out of band rejection higher than 100 dB,and the rectangle coefficient of 1.3. After tuning,the in-band return loss is improved 2.6 dB. The results show that the tuning method is effective in improving the in-band performance of HTS UWB filter.
A C-band folded planar low-pass filter utilizing U-shaped probe for high power TR module

Xi Wang,Huaiqiang Yu,Like Deng,Bin Cheng,Zhiping Fang,Xiaoyuan Lang

DOI: https://doi.org/10.1088/1742-6596/2591/1/012045

2023-09-20

Journal of Physics Conference Series

Abstract:In this paper, a C-band folded low-pass filter is realized in the planar circuit by utilizing a U-shaped probe. The proposed filter consists of four microstrip patches and a U-shaped probe. The configuration, equivalent circuit and design method of the proposed filter are demonstrated. A prototype of the low-pass filter operating in C-band has been designed, fabricated and measured. The maximum insertion loss of the fabricated filter is about 0.8 dB from 5 GHz to 6 GHz, while the maximum return loss is -11 dB. The out of band rejection is over 30 dB at 12 GHz. The measured results show reasonable correlation with the ideal circuit and the simulated results. The proposed low-pass filter can be used for the high power transmit/receive (TR) module in active electronically scanned array (AESA).
UWB Radio Module Design for Wireless Sensor Networks

Majid Baghaei Nejad,Meigen Shen,Tero Koivisto,Teemu Peltonen,Esa Tjukanoff,Hannu Tenhunen,Li-Rong Zheng

DOI: https://doi.org/10.1007/s10470-006-9617-0

IF: 1.321

2007-01-01

Analog Integrated Circuits and Signal Processing

Abstract:In this paper, we describe an impulse-based ultra wideband (UWB) radio system for wireless sensor network (WSN) applications. Different architectures have been studied for base station and sensor nodes. The base station node uses coherent UWB architecture because of the high performance and good sensitivity requirements. However, to meet complexity, power and cost constraints, the sensor module uses a novel non-coherent architecture that can autonomously detect the UWB signals. The radio modules include a transceiver block, a baseband processing unit and a power management block. The transceiver block includes a Gaussian pulse generator, a multiplier, an integrator and timing circuits. For long range applications, a wideband low noise amplifier (LNA) is included in the transceiver of the sensor module, whereas in short range applications it is simply eliminated to further reduce the power consumption. In order to verify the proposed system concept, circuit level implementation is studied using 1.5 V 0.18 μm CMOS technology. Finally, the UWB radio modules have been designed for implementation in liquid-crystal-polymer (LCP) based System-on-Package (SoP) technology for low power, low cost and small size integration. A small low cost, double-slotted, Knight’s helm antenna is embedded in the LCP substrate, which shows stable characterization and a return loss better than −10 dB over the UWB band.
A miniaturized millimeter-wave bandpass filter with LTCC technology

yongsheng dai,honghao yin,hongtu sun,yuan feng,qiuyue xie,ming luo

DOI: https://doi.org/10.1109/IMWS2.2012.6338222

2012-01-01

Abstract:This paper presents the design and simulation result of a miniaturized millimeter-wave bandpass filter realized by low temperature co-fired ceramic (LTCC) technology. The bandpass filter with a central frequency of 60 GHz and a 6 GHz pass-band is designed as a three-dimensional (3-D) structure based on distributed components. A distinct feature of this filter is the smaller size and lower in sertion loss than conventional filter at such a high frequency. With the assistance of the cross coupling which is implemented by a Z-shaped metal layer, a transmission zero is produced above the pass-band. The insertion loss is 1.6 dB and return loss is better than 20 dB within the pass-band. The overall size of the miniaturized filter is only 1.6mm×0.8mm×0.6mm.
A LTCC - Based Flat Dual - Polarized Long - Slot Array Antenna for Millimeter - Wave Applications

Pengfei Yu,Liguo Sun,Kong Zhang,Shiwei Wu

DOI: https://doi.org/10.1109/iws58240.2023.10222184

2023-01-01

Abstract:In this paper, a millimeter wave dual-polarized planar array antenna based on low temperature co-fired ceramic (LTCC), with high integration and simple feed network is proposed. Dielectric parallel plate waveguide (PPW) is used to feed vertically inserted long-slot radiation elements, to realize dual polarized radiation with high isolation. Two 1:8 substrate integrated waveguide (SIW) power dividers are arranged orthogonally to provide line sources for the PPW. The simulation and test results show that the reflection coefficient of the antenna is less than -10 dB in the 29–32 GHz frequency band, and the port isolation is greater than 30 dB. In the 30–32 GHz frequency band, the antenna gain is about 19 dBi, and the cross polarization level is lower than -25 dB. Compared with multilayer printed circuit board (PCB) process, LTCC enables higher design accuracy and better packaging characteristics, and can be applied to highly integrated millimeter wave microsystem.
Design of LTCC Multi-Layer Bandpasss Filter

XIA Hong,XU Zi-qiang,WANG Hao-qin

2008-01-01

Abstract:As a new integrating and packing technology, the low temperature co-fired ceramic (LTCC) technology attracts close attention for its excellent high frequency and high speed transfer characteristics, miniaturization, and high reliability. Modeling and analysis, optimization, and synthesis are the issues in design of LTCC filters. This paper proposes a LTCC multi-layer bandpass filter based on the technology of LTCC and the neuromodeling technique. The filter is reduced in size and can be used to miniaturize the circuit.
Design, Fabrication, and Radio Frequency Property Evaluation of a Through-Glass-via Interposer for 2.5D Radio Frequency Integration

Han Cai,Jun Yan,Shenglin Ma,Rongfeng Luo,Yanming Xia,Jiwei Li,Liulin Hu,Shuwei He,Zhongjun Tang,Yufeng Jin,Wei Wang,Jing Chen

DOI: https://doi.org/10.1088/1361-6439/ab1d30

2019-01-01

Journal of Micromechanics and Microengineering

Abstract:In this paper, a through-glass-via (TGV) interposer for 2.5D radio frequency (RF) integration is presented. A coplanar waveguide (CPW) transmission line with grounded TGVs on one side interconnects with the mounted RF devices, and an electrical ground plane on the other side. Tapered TGVs are fabricated using a combined method of sandblasting and thinning/polishing process to achieve precise control of the profile of the vias and improve uniformity. The TGVs are metalized by conformal copper (Cu) electroplating to form a vertical interconnection between the upper and lower metal layers, which can maintain RF performance and avoid thermal stress issues. The CPW transmission lines with electrically grounded TGVs and test structures are designed, fabricated and tested to evaluate the TGV's RF performance and suitability for 2.5D RF integration. The RF measurements show that the insertion loss is about 0.13 dB mm(-1) @ 10 GHz for the CPW line with grounded TGV which is less than 0.1 dB @ 10 GHz for a single TGV. We analyzed S parameter for the tests and simulations when taking into account various factors in the manufacturing process, such as the surface roughness and metal resistivity. The results provide a research direction for the optimization of the parameters in the follow-up study. In addition, a 2.5D RF receiver module based on the proposed TGV interposer in the L-band is assembled and validated. The gain value of the TGV interposer integrated RF module is about 14.4 dB, which is close to the theoretical value.

Design of a UWB LTCC T/R Module

A Compact 2-18Ghz Ultra-Wideband Frequency-conversion T/R Module Based on a 3D Heterogeneous Integrated Process

W Band Substrate-Integrated Slot Antenna-In-Package Using Higher Order Mode

AN OVERALL LTCC PACKAGE SOLUTION FOR X-BAND TILE T/R MODULE

UWB Radio Module Design for Wireless Intelligent Systems-From Specification to Implementation

The design and fabrication of RF band pass filter by LTCC technology

Design of a Ka-Band Heterogeneous Integrated T/R Module of Phased Array Antenna

Design of On-Chip Dual-Band Bandpass Filter Using Lumped Elements in LTCC Technology

Design of LTCC Wilkinson power divider for microwave modules

Design and fabrication of 2.45G miniaturized band pass filter by LTCC technology

DESIGN OF AN ULTRA-WIDEBAND (UWB) HTS FILTER IN UHF-BAND

Co-design of ESD Protection and UWB RF Front-End ICs

Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging

Design of miniaturized short wave tunable bandpass filter with wide tuning range based on LTCC technology

DESIGN AND TRIMMING METHOD OF A P-BAND HTS ULTRA-WIDEBAND (UWB) FILTER USING SHUNT-STUB STRUCTURE

A C-band folded planar low-pass filter utilizing U-shaped probe for high power TR module

UWB Radio Module Design for Wireless Sensor Networks

A miniaturized millimeter-wave bandpass filter with LTCC technology

A LTCC - Based Flat Dual - Polarized Long - Slot Array Antenna for Millimeter - Wave Applications

Design of LTCC Multi-Layer Bandpasss Filter

Design, Fabrication, and Radio Frequency Property Evaluation of a Through-Glass-via Interposer for 2.5D Radio Frequency Integration