Optimization of PCB disassembly heating parameters based on genetic algorithm

Gao Peng,Xiang Dong,Yang Ji-ping,Cheng Yang,Duan Guang-hong,Ding Xiao-yu
DOI: https://doi.org/10.3969/j.issn.1671-3133.2008.08.027
2008-01-01
Abstract:In order to optimize heating parameters to make sure of high disassembly and pass rate of PCB components,mapping relationship between hating parameters and disassembly and pass rate was built based on orthogonal experiments and BP neural network.Stability and reliability of neural network were proved.No-expression,multi-target and discrete disassembly problem was optimized applying genetic algorithm,which converged to a stable and valid solution.Optimized parameters have high network prediction and experiment values of disassembly and pass rate.
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