0.18Μm CMOS, Monolithic MSTP ASIC

Wang Peng,Jin Depeng,Zeng Lieguang
DOI: https://doi.org/10.1007/s11767-006-0026-4
2006-01-01
Abstract:A highly integrated monolithic Multi-Service Transport Platform (MSTP) Application Specified Integrated Circuit (ASIC) MSEOSX8-6 has been fabricated with 0.18μm CMOS technology incorporating 26×106 transistors. The chip is designed to provide standard framing and mapping of 10/100/1000Mbit/s Ethernet, Resilient Packet Ring (RPR) and E1 traffics into protected Synchronous Digital Hierarchy (SDH) STM-1 transport payloads using hitless rate adaptation for optimum bandwidth utilization. It consumes 4W of power on average and utilizes 756 pin enhanced BGA package.
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