Additive-aided Electrochemical Deposition of Bismuth Telluride in a Basic Electrolyte

Wu-jun Qiu,Sheng-nan Zhang,Tie-jun Zhu,Xin-bing Zhao
DOI: https://doi.org/10.1007/s12613-010-0346-0
2010-01-01
Abstract:A new basic electrolyte with two cationic plating additives, polydiaminourea and polyaminosulfone, was investigated for the electrochemical deposition of the bismuth telluride film on a nickel-plated copper foil. Tellurium starts to deposit at a higher potential (−0.35 V) than bismuth (−0.5 V) in this electrolyte. The tellurium-to-bismuth ratio increases while the deposition potential declines from −1 to −1.25 V, indicating a kinetically quicker bismuth deposition at higher potentials. The as-deposited film features good adhesion to the substrate and smooth morphology, and has a nearly amorphous crystal structure disclosed by X-ray diffraction patterns.
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