Abstract:Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe thermal issues like temperature escalation, high thermal gradients, and excessive hot spot formation, which may result in degrading chip performance, accelerating device aging, and premature failure. Thermal-Aware Scheduling (TAS) enables optimization of thermal dissipation to maintain a safe thermal state. In this work, we implement a new TAS algorithm, POD-TAS, which manages the thermal behavior of a multi-core CPU based on a defined set of states and their transitions. We compare the performances of a dynamic RC thermal circuit simulator (HotSpot) and a reduced order Proper Orthogonal Decomposition (POD)-based thermal model and we select the latter for use in our POD-TAS algorithm. We implement a novel simulation-based evaluation methodology to compare TAS algorithms. This methodology is used to evaluate the performance of the proposed POD-TAS algorithm. Additionally, we compare the performance of a state of the art TAS algorithm, RT-TAS, to our proposed POD-TAS algorithm. Furthermore, we utilize the COMBS benchmark suite to provide CPU workloads for task scheduling. Our experimental results on a multi-core processor using a set of 4 benchmarks demonstrate that the proposed POD-TAS method can improve thermal performance by decreasing the peak thermal variance by 53.0% and the peak chip temperature of 29.01%. Using a set of 8 benchmarks, the comparison of the two algorithms shows a decrease of 29.57% in the peak spatial variance of the chip temperature and 26.26% in the peak chip temperature. We also identify several potential future research directions.

Reducing the Number of Sensors under Hot Spot Temperature Error Bound for Microprocessors Based on Dual Clustering

Research of thermal sensor allocation and placement based on dual clustering for microprocessors

Sensor Allocation Based on the Maximum Error in Thermal Monitoring for Microprocessors

Thermal camera networks for large datacenters using real-time thermal monitoring mechanism

Temperature sensor allocation strategy and full thermal reconstruction for microprocessors

Accurate On-Chip Thermal Peak Detection Based on Heuristic Algorithms and Embedded Temperature Sensors

A Nearest-Neighbor-Based Thermal Sensor Allocation and Temperature Reconstruction Method for 3-D NoC-Based Multicore Systems

Peak Temperature Minimization via Task Allocation and Splitting for Heterogeneous MPSoC Real-Time Systems

Thermal-aware Resource Usage Allocation

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

Data-driven Sensor Placement for Efficient Thermal Field Reconstruction

Dynamic Thermal Management for 3-D ICs with Time-Dependent Power Map Using Microchannel Cooling and Machine Learning

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Thermal-Aware Task Scheduling for Energy Minimization in Heterogeneous Real-Time MPSoC Systems.

Temperature-aware microarchitecture

A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

Self-Adapting Power Density Sampling for On-Chip Thermal Prediction With Transistor-Level Granularity

Inverse Distance Weighting Method Based on a Dynamic Voronoi Diagram for Thermal Reconstruction with Limited Sensor Data on Multiprocessors

A Temperature Sensor Clustering Method for Thermal Error Modeling of Heavy Milling Machine Tools

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits