Insert Process of the Double-Deck Microgear Mold Based on the UV-LIGA Technology

Li Randeng,Qin Zonghui,Zhou Jia
DOI: https://doi.org/10.3969/j.issn.1671-4776.2012.02.011
2012-01-01
Abstract:UV-LIGA technology was adopted to fabricate the insert of the double-deck microgear mold on the indium tin oxidation(ITO) glass substrate.Firstly,through the photoetching with the positive photoresist(RZJ-304),the nickel mask was electroplated on the ITO substrate.The first layer photoresist of the SU-8 was exposed from the backside with the nickel mask.Then the second layer photoresist of the SU-8 was exposed by the alignment from the front side.The photoresist mold of the double-deck microgear was obtained after developing.Finally,the mold insert was made by electroplating.The feasibility of the fabrication process flow was confirmed through the experiment,and the technological parameters were optimized.Through utilizing the exposure from the backside and the alignment from the front side,the problems caused by the under exposure of the bottom were resolved.The issues emerging in the fabrication process were studied,such as the uneven coating,instability of the adhesive layer in the prebake,uneven hea-ting of the hot plate and the damage of the adhesive layer caused by the contact-type exposure.The photoresist mold of the double-deck microgear fabricated in the experiment is of high verticality,good surface quality and superior alignment precision.
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