Advanced NDT with high resolution Computed Tomography

Thomas PAUL,Zhenhui HE

2008-01-01

Abstract:In today's quality market, achieving the smallest feature recognition possible in the inspection process has become a higher priority than ever before. Due to com plex geometries and miniaturization of many high reliability components in the automotive, electronics and aerospace industries, achieving this level of feature recognition has also become increasingly difficult. Due to inherent limitations, many of the inspection requirements can no longer be satisfied with conventional X -ray inspection methods such as 2D X-ray inspection. For example, the depth of detail is not quantif iable, which in some cases can be vital to the manufacturing process. High resolution Computed Tomography (CT) presents an effective method of mapping the internal structure of components in three dimensions. With this technique, any internal difference that correspon ds to a contrast in material, density or porosity can be visualized and measured. These properties allow the us e of CT as an NDT tool, permitting examination of samples for internal porosity, cracks, delamination, inc lusions and mechanical fit. CT techniques are used to measure internal distances or the internal wall thicknes s of complex castings and areas which are often inaccessible for optical scanners or conventional tact ile coordinate measurement machines (CMM). The CT volume data provides information for reverse engineering or first article inspection of the entire part by mer ging it with the CAD model to generate a variance map of bot h data sets. Combined these capabilities contribute t o early detection of process and product weaknesses therefo re increasing yield and productivity. Modern microfocus and nanofocus ®1 systems are not only suitable for examinations of low absorbing materials like synthetics, but also for the analysis of the inter nal microstructure of higher absorbing metal castings, ceramics or composites containing high absorbing parti cles. High resolution CT widely expands the spectrum of X-ray detectable defects in process control and fail ure analysis increasing reliability and safety of components for, e.g., automotive, aerospace, and militar y applications. It opens a new dimension for 3D quality assurance and will partially replace destructive methods l ike cross-sectioning - saving costs and time per sample inspected. For high resolution NDT with Computed Tomography, a wide range of systems is available. This starts with microfocus X-ray systems like x|argos for real time ins pection of large castings which may be upgraded for Computed Tomography - this makes the advantages of 3D inspection affordable even for smaller companies. For high resolution high quality CT the nanotom ®1 is the first 180 kV nanoCT ®1 system with the capability to analyse small samples with the exceptional voxel-resolut ion of less than 0.5 microns per volume pixel (voxel). For example, object surfaces of molded plastics, light meta l castings and any internal details related to a variation in material, density or porosity can be visua lized and precisely measured.