Influence of Doped Cu-Zn on Structure and Properties of TiN Films

Wei Chun-Bei,Gong Chun-Zhi,Tian Xiu-Bo,Yang Shi-Qin
DOI: https://doi.org/10.3724/sp.j.1077.2009.01231
IF: 1.292
2009-01-01
Journal of Inorganic Materials
Abstract:Cu-Zn doped TiN films were fabricated on stainless steel by hybird magnetron sputtering. Influences of Cu and Zn concentration on structure and properties (such as microhardness, wear res,stance and corrosion resistance) of the films were investigated. The results Indicate that growth of TiN grains is blocked by (loped Cu and Zn and TiN grain size decreases with increasing Cu and Zn concentration. In contrast, high Cu and Zn content induces coarse structure due to the growth of copper grains. With Cu <= 10.38at% and Z(n)<= 2.19at%, the films show a preferred TiN (111) texture orientation, and TiN (200) orientation enhances with increasing the (loped element content. XPS results show that the films are mainly composed of TiN and pure Cu. The composite film with co-doping 10.38at% Cu and 2.19at% Zn exhibits higher microhardness and wear resistance. The passivation potential is substantially improved with small amount of Cu-Zn although the corrosion resistance of the films decreases with increasing Cu and Zn concentration.
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